High-performance packaging technology for ultra-high-speed ATM switching system

Katsumi Kaizu, Tohru Kishimoto, Shinich Sasaki, Naoaki Yamanaka, Kouichi Genda

Research output: Contribution to journalArticlepeer-review


This paper describes high-performance, high-density multichip modules (MCMs) using a copper polyimide multi-layer substrate and innovative heat-pipe cooling for high-speed ATM switching system. High-speed ATM link wires are interconnected on the top surface of the MCMs by the newly developed flexible printed circuit cables and connectors to reduce the rear-side I/O count and achieve 620-Mbit/s 32-bit parallel interconnection. A heat-pipe is attached to the back surface of each MCM to cool the power dissipation, which is 30 W per MCM. With a 2-m/s forced airflow, a prototype ATM switch system operated at 320 Gbit/s (with 8×8 MCMs) with a maximum junction temperature of less than 85 °C. These results indicate that this technology is suitable for future B-ISDN high-speed swithing systems.

Original languageEnglish
Pages (from-to)863-871
Number of pages9
JournalNTT R and D
Issue number9
Publication statusPublished - 1996 Dec 1
Externally publishedYes

ASJC Scopus subject areas

  • Electrical and Electronic Engineering


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