High-precision analysis of internal deformation/fracture characteristics of a material by using submicron 3D CT images

Mitsuru Nakazawa; Masakazu Kobayashi; Hiroyuki Toda; Yoshimitsu Aoki

doi:10.1541/ieejias.131.548

High-precision analysis of internal deformation/fracture characteristics of a material by using submicron 3D CT images

Mitsuru Nakazawa, Masakazu Kobayashi, Hiroyuki Toda, Yoshimitsu Aoki

Research output: Contribution to journal › Article › peer-review

Abstract

In material engineering, it is widely recognized that deformation and fracture (D/F) characteristics are important because the safety of developed materials can be determined on the basis of D/F characteristics. The D/F characteristic is defined as the load required to break the material and the strain caused by applying a particular load. To observe the effect of grain boundary slip at the micron level, we have proposed a method of obtaining displacement vectors of internal structures from submicron 3D CT images. In this paper, we introduce an improved method for accurately acquiring D/F characteristics. The results of a simulation and a real test confirm the effectiveness of the improved method.

Original language	English
Pages (from-to)	548-556+17
Journal	ieej transactions on industry applications
Volume	131
Issue number	4
DOIs	https://doi.org/10.1541/ieejias.131.548
Publication status	Published - 2011 Sept 9

Keywords

3D CT
Material evaluation
Mismatch-detection
PTV
Submicron analysis

ASJC Scopus subject areas

Industrial and Manufacturing Engineering
Electrical and Electronic Engineering

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10.1541/ieejias.131.548

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abstract = "In material engineering, it is widely recognized that deformation and fracture (D/F) characteristics are important because the safety of developed materials can be determined on the basis of D/F characteristics. The D/F characteristic is defined as the load required to break the material and the strain caused by applying a particular load. To observe the effect of grain boundary slip at the micron level, we have proposed a method of obtaining displacement vectors of internal structures from submicron 3D CT images. In this paper, we introduce an improved method for accurately acquiring D/F characteristics. The results of a simulation and a real test confirm the effectiveness of the improved method.",

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AU - Nakazawa, Mitsuru

AU - Kobayashi, Masakazu

AU - Toda, Hiroyuki

AU - Aoki, Yoshimitsu

PY - 2011/9/9

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N2 - In material engineering, it is widely recognized that deformation and fracture (D/F) characteristics are important because the safety of developed materials can be determined on the basis of D/F characteristics. The D/F characteristic is defined as the load required to break the material and the strain caused by applying a particular load. To observe the effect of grain boundary slip at the micron level, we have proposed a method of obtaining displacement vectors of internal structures from submicron 3D CT images. In this paper, we introduce an improved method for accurately acquiring D/F characteristics. The results of a simulation and a real test confirm the effectiveness of the improved method.

AB - In material engineering, it is widely recognized that deformation and fracture (D/F) characteristics are important because the safety of developed materials can be determined on the basis of D/F characteristics. The D/F characteristic is defined as the load required to break the material and the strain caused by applying a particular load. To observe the effect of grain boundary slip at the micron level, we have proposed a method of obtaining displacement vectors of internal structures from submicron 3D CT images. In this paper, we introduce an improved method for accurately acquiring D/F characteristics. The results of a simulation and a real test confirm the effectiveness of the improved method.

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KW - Material evaluation

KW - Mismatch-detection

KW - PTV

KW - Submicron analysis

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High-precision analysis of internal deformation/fracture characteristics of a material by using submicron 3D CT images

Abstract

Keywords

ASJC Scopus subject areas

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