High-speed on-chip and inter-chip optical interconnect technology for Tbit/s communication

H. Tsuda, Y. Mizutani, T. Kuroda, T. Nakahara

Research output: Chapter in Book/Report/Conference proceedingConference contribution


The present and the potential performances of chip-to-chip and on-chip optical interconnections using vertical cavity surface emitting lasers are studied. The fabrication and the integration technologies of the smart pixels are also described.

Original languageEnglish
Title of host publicationFrontiers in Optics, FiO 2003
PublisherOptica Publishing Group (formerly OSA)
ISBN (Electronic)1557527598
Publication statusPublished - 2003
EventFrontiers in Optics, FiO 2003 - Tucson, United States
Duration: 2003 Oct 5 → …

Publication series

NameOptics InfoBase Conference Papers
ISSN (Electronic)2162-2701


ConferenceFrontiers in Optics, FiO 2003
Country/TerritoryUnited States
Period03/10/5 → …

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Mechanics of Materials


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