TY - GEN
T1 - Highly scalable nonvolatile TiOx/TaSiOy solid-electrolyte crossbar switch integrated in local interconnect for low power reconfigurable logic
AU - Tada, M.
AU - Sakamoto, T.
AU - Tsuji, Y.
AU - Banno, N.
AU - Saito, Y.
AU - Yabe, Y.
AU - Ishida, S.
AU - Terai, M.
AU - Kotsuji, S.
AU - Iguchi, N.
AU - Aono, M.
AU - Hada, H.
AU - Kasai, N.
PY - 2009
Y1 - 2009
N2 - A fully logic-compatible, nonvolatile crossbar switch using a novel dual-layer TiOx/TaSiOy solid-electrolyte, "NanoBridge", has been developed for the first time, which is scalable to 50 nm and beyond and keeps the extremely low ON-resistance of <100 Ω A key breakthrough is the dual-layer solid-electrolyte, in which TiOx works as an oxygen absorber as well as a superior ionic conductor, thus improving the yield, ON/OFF resistance ratio (>106) and cycling endurance (>103). The highly scalable 4 × 4 crossbar switch composed of NanoBridge integrated in a local Cu interconnect of a standard CMOS is successfully configured without select transistors. The nonvolatile solid-electrolyte, crossbar switch is a promising switch element for low power and low cost reconfigurable logic.
AB - A fully logic-compatible, nonvolatile crossbar switch using a novel dual-layer TiOx/TaSiOy solid-electrolyte, "NanoBridge", has been developed for the first time, which is scalable to 50 nm and beyond and keeps the extremely low ON-resistance of <100 Ω A key breakthrough is the dual-layer solid-electrolyte, in which TiOx works as an oxygen absorber as well as a superior ionic conductor, thus improving the yield, ON/OFF resistance ratio (>106) and cycling endurance (>103). The highly scalable 4 × 4 crossbar switch composed of NanoBridge integrated in a local Cu interconnect of a standard CMOS is successfully configured without select transistors. The nonvolatile solid-electrolyte, crossbar switch is a promising switch element for low power and low cost reconfigurable logic.
UR - https://www.scopus.com/pages/publications/77952344227
UR - https://www.scopus.com/pages/publications/77952344227#tab=citedBy
U2 - 10.1109/IEDM.2009.5424287
DO - 10.1109/IEDM.2009.5424287
M3 - Conference contribution
AN - SCOPUS:77952344227
SN - 9781424456406
T3 - Technical Digest - International Electron Devices Meeting, IEDM
SP - 38.5.1-38.5.4
BT - 2009 International Electron Devices Meeting, IEDM 2009 - Technical Digest
T2 - 2009 International Electron Devices Meeting, IEDM 2009
Y2 - 7 December 2009 through 9 December 2009
ER -