TY - GEN
T1 - Improvement in electrical properties of carbon nanotube via interconnects
AU - Katagiri, Masayuki
AU - Yamazaki, Yuichi
AU - Wada, Makoto
AU - Kitamura, Masayuki
AU - Sakuma, Naoshi
AU - Suzuki, Mariko
AU - Sato, Shintaro
AU - Nihei, Mizuhisa
AU - Kajita, Akihiro
AU - Sakai, Tadashi
AU - Awano, Yuji
PY - 2010/12/1
Y1 - 2010/12/1
N2 - We report on the electrical properties of carbon nanotube (CNT) via interconnects with improvement in contact formations between CNTs and metal electrodes. For the improvement of the bottom contact, formation processes of barrier layers on a Cu wiring layer are optimized. The current-voltage characteristics of ultrafine CNT via interconnects exhibit ohmic properties. The resistance of the CNT via is inversely proportional to the via area, indicating good uniformity of the CNT growth in the via.
AB - We report on the electrical properties of carbon nanotube (CNT) via interconnects with improvement in contact formations between CNTs and metal electrodes. For the improvement of the bottom contact, formation processes of barrier layers on a Cu wiring layer are optimized. The current-voltage characteristics of ultrafine CNT via interconnects exhibit ohmic properties. The resistance of the CNT via is inversely proportional to the via area, indicating good uniformity of the CNT growth in the via.
UR - http://www.scopus.com/inward/record.url?scp=79957640085&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=79957640085&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:79957640085
SN - 9781617822810
T3 - Advanced Metallization Conference (AMC)
SP - 152
EP - 153
BT - Advanced Metallization Conference 2010
T2 - Advanced Metallization Conference 2010
Y2 - 5 October 2010 through 7 October 2010
ER -