Inductive coupling transceivers for inter-chip data communication

Tadahiro Kuroda

doi:10.1109/RFIT.2009.5383655

Inductive coupling transceivers for inter-chip data communication

Tadahiro Kuroda

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

ThruChip Interface (TCI) employing inductive coupling bares comparison with TSV in performance with much inexpensive cost. It is available for production. For instance, Solid-State Drive (SSD) in a package can be realized by stacking NAND Flash memories. A high-speed low-power DRAM interface can be implemented. Extension of communication distance to millimeter ranges makes it possible to probe internal bus data through package for debugging and to perform non-contact wafer simultaneous testing. Wireless power delivery by using inductive coupling will further widen the applications. In this paper technology and applications of the TCI are presented.

Original language	English
Title of host publication	2009 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2009
Pages	13-15
Number of pages	3
DOIs	https://doi.org/10.1109/RFIT.2009.5383655
Publication status	Published - 2009
Event	2009 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2009 - Singapore, Singapore Duration: 2009 Jan 9 → 2009 Jan 11

Publication series

Name	2009 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2009

Other

Other	2009 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2009
Country/Territory	Singapore
City	Singapore
Period	09/1/9 → 09/1/11

ASJC Scopus subject areas

Computer Networks and Communications
Electrical and Electronic Engineering

Access to Document

10.1109/RFIT.2009.5383655

Cite this

Inductive coupling transceivers for inter-chip data communication. / Kuroda, Tadahiro.
2009 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2009. 2009. p. 13-15 5383655 (2009 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2009).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Kuroda, T 2009, Inductive coupling transceivers for inter-chip data communication. in 2009 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2009., 5383655, 2009 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2009, pp. 13-15, 2009 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2009, Singapore, Singapore, 09/1/9. https://doi.org/10.1109/RFIT.2009.5383655

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Inductive coupling transceivers for inter-chip data communication

Abstract

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Other

ASJC Scopus subject areas

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