Integration of carbon nanotubes into via structures

Yuji Awano

Research output: Chapter in Book/Report/Conference proceedingConference contribution


Carbon nanotubes (CNTs) offer unique properties such as the highest current density exceeding 109 A/cm2, ultra-high thermal conductivity, ballistic transport along the tube and extremely high mechanical strength with high aspect ratio of the structure. Because of these remarkable properties, they have been expected for use as future wiring materials to solve several problems in future LSIs. In this paper, we demonstrate present status of CNT material technologies and the potential of metallic CNT via technology. In particular, we report our new approach to fabricating CNT via interconnects, where we use preformed catalyst nanoparticles to grow diameter-controlled CNTs at low temperature.

Original languageEnglish
Title of host publicationAdvanced Metallization Conference 2006, AMC 2006
Number of pages9
Publication statusPublished - 2006 Dec 1
Externally publishedYes
Event23rd Annual Advanced Metallization Conference, AMC 2006 - San Diego, CA, United States
Duration: 2006 Oct 172006 Oct 19

Publication series

NameAdvanced Metallization Conference (AMC)
ISSN (Print)1540-1766


Other23rd Annual Advanced Metallization Conference, AMC 2006
Country/TerritoryUnited States
CitySan Diego, CA

ASJC Scopus subject areas

  • General Chemical Engineering


Dive into the research topics of 'Integration of carbon nanotubes into via structures'. Together they form a unique fingerprint.

Cite this