Introduction to the special session on 'Interconnect enhances architecture: Evolution of wireless NoC from planar to 3D'

Radu Marculescu; Partha Pratim Pande; Deukhyoun Heo; Hiroki Matsutani

doi:10.1109/NOCS.2014.7008780

Introduction to the special session on 'Interconnect enhances architecture: Evolution of wireless NoC from planar to 3D'

Radu Marculescu, Partha Pratim Pande, Deukhyoun Heo, Hiroki Matsutani

Department of Information and Computer Science

Research output: Contribution to journal › Editorial › peer-review

Original language	English
Article number	7008780
Pages (from-to)	174-175
Number of pages	2
Journal	Proceedings - 2014 8th IEEE/ACM International Symposium on Networks-on-Chip, NoCS 2014
DOIs	https://doi.org/10.1109/NOCS.2014.7008780
Publication status	Published - 2015 Jan 13
Event	8th IEEE/ACM International Symposium on Networks-on-Chip, NoCS 2014 - Ferrara, Italy Duration: 2014 Sept 17 → 2014 Sept 19

ASJC Scopus subject areas

Computer Networks and Communications
Hardware and Architecture
Electrical and Electronic Engineering

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10.1109/NOCS.2014.7008780

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Introduction to the special session on 'Interconnect enhances architecture: Evolution of wireless NoC from planar to 3D'. / Marculescu, Radu; Pande, Partha Pratim; Heo, Deukhyoun et al.
In: Proceedings - 2014 8th IEEE/ACM International Symposium on Networks-on-Chip, NoCS 2014, 13.01.2015, p. 174-175.

Research output: Contribution to journal › Editorial › peer-review

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author = "Radu Marculescu and Pande, {Partha Pratim} and Deukhyoun Heo and Hiroki Matsutani",

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AU - Matsutani, Hiroki

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JO - Proceedings - 2014 8th IEEE/ACM International Symposium on Networks-on-Chip, NoCS 2014

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Introduction to the special session on 'Interconnect enhances architecture: Evolution of wireless NoC from planar to 3D'

ASJC Scopus subject areas

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