TY - JOUR
T1 - Laser micro-Raman spectroscopy of single-point diamond machined silicon substrates
AU - Yan, Jiwang
N1 - Copyright:
Copyright 2008 Elsevier B.V., All rights reserved.
PY - 2004/2/15
Y1 - 2004/2/15
N2 - Due to its hard and brittle nature, silicon is currently finished by lapping and chemomechanical polishing (CMP). However, silicon can be plastically deformed in a ductile manner in ultraprecision machining at an extremely smooth surfaces. Using the ductile machining technology, the productivity of aspherical, diffractive optical components, and large-diameter substrates for recent microelectronic mechanical system (MEMS) applications can be significantly improved.
AB - Due to its hard and brittle nature, silicon is currently finished by lapping and chemomechanical polishing (CMP). However, silicon can be plastically deformed in a ductile manner in ultraprecision machining at an extremely smooth surfaces. Using the ductile machining technology, the productivity of aspherical, diffractive optical components, and large-diameter substrates for recent microelectronic mechanical system (MEMS) applications can be significantly improved.
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U2 - 10.1063/1.1639953
DO - 10.1063/1.1639953
M3 - Article
AN - SCOPUS:1542276675
SN - 0021-8979
VL - 95
SP - 2094
EP - 2101
JO - Journal of Applied Physics
JF - Journal of Applied Physics
IS - 4
ER -