TY - GEN
T1 - Linearity and heat resisting improvement low-voltage fluid-based inclination sensor by using silica coating process
AU - Manaf, Asrulnizam Bin Abd
AU - Sidek, Othman
AU - Matsumoto, Yoshinori
PY - 2009/12/1
Y1 - 2009/12/1
N2 - In this paper, we proposed a sealing technique for a sealing glass cap with a ceramic substrate by using silica coating liquid to increase the performance of fluid-based inclination sensor in heat-resisting and durability characteristic. The sensor was developed with one-side-electrode-type structure and propylene carbonate was used as electrolyte. The sensor uses capacitance change to detect the angle of inclination, and it is capable measuring inclination at supply voltage 1.5 V. The diameter of glass cap and height were 4.0 mm and 2.0 mm, respectively. The linearity of characteristic can be improved when the supply voltage was set at 1.5 V. The sensitivity , response time and resolution of sensor were 4 mV/deg, 0.6 s and 1.8 deg, respectively at the supply voltage 1.5 V. The temperature characteristic was evaluated between -10 °C to 50°C.
AB - In this paper, we proposed a sealing technique for a sealing glass cap with a ceramic substrate by using silica coating liquid to increase the performance of fluid-based inclination sensor in heat-resisting and durability characteristic. The sensor was developed with one-side-electrode-type structure and propylene carbonate was used as electrolyte. The sensor uses capacitance change to detect the angle of inclination, and it is capable measuring inclination at supply voltage 1.5 V. The diameter of glass cap and height were 4.0 mm and 2.0 mm, respectively. The linearity of characteristic can be improved when the supply voltage was set at 1.5 V. The sensitivity , response time and resolution of sensor were 4 mV/deg, 0.6 s and 1.8 deg, respectively at the supply voltage 1.5 V. The temperature characteristic was evaluated between -10 °C to 50°C.
UR - http://www.scopus.com/inward/record.url?scp=77951110126&partnerID=8YFLogxK
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U2 - 10.1109/ICSENS.2009.5398206
DO - 10.1109/ICSENS.2009.5398206
M3 - Conference contribution
AN - SCOPUS:77951110126
SN - 9781424445486
T3 - Proceedings of IEEE Sensors
SP - 168
EP - 172
BT - IEEE Sensors 2009 Conference - SENSORS 2009
T2 - IEEE Sensors 2009 Conference - SENSORS 2009
Y2 - 25 October 2009 through 28 October 2009
ER -