Liquid encapsulation by Bonding-in-Liquid Technique

Yoshiyuki Okayama, Keijiro Nakahara, Takeshi Ninomiya, Yasuaki Matsumoto, Norihisa Miki

Research output: Chapter in Book/Report/Conference proceedingConference contribution


We propose and demonstrate Bonding-in-Liquid Technique (BiLT) for encapsulation of liquid in MEMS devices. Liquid encapsulation enables innovative MEMS devices with various functions. Interfusion of air bubbles, heterogeneity of the liquid quantity, and leakage of the encapsulated liquid must be averted not to deteriorate device performances. In BiLT, two structural layers are passively aligned and brought into contact in solution, where the encapsulation cavities are uniformly filled up with the liquid without air bubbles. A UV-curable resin is used as an adhesive that does not require heat or vacuum environment but UV to bond the two layers. We successfully achieved encapsulation of DI water and glycerin in silicon structural layers. Since conventional aligners are not applicable to BiLT, we experimentally evaluated the accuracy of the passive alignment process in solution that makes use of matching concave and convex structures.

Original languageEnglish
Title of host publicationMicroelectromechanical Systems - Materials and Devices III
Number of pages6
Publication statusPublished - 2010 Aug 30
Event2009 MRS Fall Meeting - Boston, MA, United States
Duration: 2009 Nov 302009 Dec 4

Publication series

NameMaterials Research Society Symposium Proceedings
ISSN (Print)0272-9172


Other2009 MRS Fall Meeting
Country/TerritoryUnited States
CityBoston, MA

ASJC Scopus subject areas

  • General Materials Science
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering


Dive into the research topics of 'Liquid encapsulation by Bonding-in-Liquid Technique'. Together they form a unique fingerprint.

Cite this