Message from the Organizing Committee Chair

Hideharu Amano

Research output: Contribution to journalEditorialpeer-review

Original languageEnglish
Article number8721341
Pages (from-to)I-II
JournalIEEE Symposium on Low-Power and High-Speed Chips and Systems, COOL CHIPS 2019 - Proceedings
DOIs
Publication statusPublished - 2019 May 23
Event22nd IEEE Symposium on Low-Power and High-Speed Chips and Systems, COOL CHIPS 2019 - Yokohama, Japan
Duration: 2019 Apr 172019 Apr 19

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

Cite this