Message from the Organizing Committee Chair

Research output: Contribution to journal › Editorial › peer-review

Original language	English
Article number	8721341
Pages (from-to)	I-II
Journal	IEEE Symposium on Low-Power and High-Speed Chips and Systems, COOL CHIPS 2019 - Proceedings
DOIs	https://doi.org/10.1109/CoolChips.2019.8721341
Publication status	Published - 2019 May 23
Event	22nd IEEE Symposium on Low-Power and High-Speed Chips and Systems, COOL CHIPS 2019 - Yokohama, Japan Duration: 2019 Apr 17 → 2019 Apr 19

ASJC Scopus subject areas

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title = "Message from the Organizing Committee Chair",

author = "Hideharu Amano",

year = "2019",

month = may,

day = "23",

doi = "10.1109/CoolChips.2019.8721341",

language = "English",

pages = "I--II",

journal = "IEEE Symposium on Low-Power and High-Speed Chips and Systems, COOL CHIPS 2019 - Proceedings",

note = "22nd IEEE Symposium on Low-Power and High-Speed Chips and Systems, COOL CHIPS 2019 ; Conference date: 17-04-2019 Through 19-04-2019",

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AU - Amano, Hideharu

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JO - IEEE Symposium on Low-Power and High-Speed Chips and Systems, COOL CHIPS 2019 - Proceedings

JF - IEEE Symposium on Low-Power and High-Speed Chips and Systems, COOL CHIPS 2019 - Proceedings

M1 - 8721341

T2 - 22nd IEEE Symposium on Low-Power and High-Speed Chips and Systems, COOL CHIPS 2019

Y2 - 17 April 2019 through 19 April 2019

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