Nano-scale Fracture Test for Local Interface Adhesion Strength Evaluation in LSI Interconnects

N. Shishido; H. Sugiyama; S. Kamiya; H. Sato; K. Koiwa; M. Nishida; M. Omiya; T. Nagasawa; T. Nokuo; T. Suzuki; T. Nakamura

doi:10.1017/S1431927612005685

Nano-scale Fracture Test for Local Interface Adhesion Strength Evaluation in LSI Interconnects

N. Shishido, H. Sugiyama, S. Kamiya, H. Sato, K. Koiwa, M. Nishida, M. Omiya, T. Nagasawa, T. Nokuo, T. Suzuki, T. Nakamura

Department of Mechanical Engineering

Research output: Contribution to journal › Article › peer-review

Original language	English
Pages (from-to)	766-767
Number of pages	2
Journal	Microscopy and Microanalysis
Volume	18
DOIs	https://doi.org/10.1017/S1431927612005685
Publication status	Published - 2012 Jul

ASJC Scopus subject areas

Instrumentation

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10.1017/S1431927612005685

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title = "Nano-scale Fracture Test for Local Interface Adhesion Strength Evaluation in LSI Interconnects",

author = "N. Shishido and H. Sugiyama and S. Kamiya and H. Sato and K. Koiwa and M. Nishida and M. Omiya and T. Nagasawa and T. Nokuo and T. Suzuki and T. Nakamura",

year = "2012",

month = jul,

doi = "10.1017/S1431927612005685",

language = "English",

volume = "18",

pages = "766--767",

journal = "Microscopy and Microanalysis",

issn = "1431-9276",

publisher = "Cambridge University Press",

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T1 - Nano-scale Fracture Test for Local Interface Adhesion Strength Evaluation in LSI Interconnects

AU - Shishido, N.

AU - Sugiyama, H.

AU - Kamiya, S.

AU - Sato, H.

AU - Koiwa, K.

AU - Nishida, M.

AU - Omiya, M.

AU - Nagasawa, T.

AU - Nokuo, T.

AU - Suzuki, T.

AU - Nakamura, T.

PY - 2012/7

Y1 - 2012/7

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U2 - 10.1017/S1431927612005685

DO - 10.1017/S1431927612005685

M3 - Article

AN - SCOPUS:85007943307

SN - 1431-9276

VL - 18

SP - 766

EP - 767

JO - Microscopy and Microanalysis

JF - Microscopy and Microanalysis

ER -

Nano-scale Fracture Test for Local Interface Adhesion Strength Evaluation in LSI Interconnects

ASJC Scopus subject areas

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