Nanoindentation tests on diamond-machined silicon wafers

Jiwang Yan, Hirokazu Takahashi, Jun'ichi Tamaki, Xiaohui Gai, Hirofumi Harada, John Patten

Research output: Contribution to journalArticlepeer-review

62 Citations (Scopus)


Nanoindentation tests were performed on ultraprecision diamond-turned silicon wafers and the results were compared with those of pristine silicon wafers. Remarkable differences were found between the two kinds of test results in terms of load-displacement characteristics and indent topologies. The machining-induced amorphous layer was found to have significantly higher microplasticity and lower hardness than pristine silicon. When machining silicon in the ductile mode, we are in essence always machining amorphous silicon left behind by the preceding tool pass; thus, it is the amorphous phase that dominates the machining performance. This work indicated the feasibility of detecting the presence and the mechanical properties of the machining-induced amorphous layers by nanoindentation.

Original languageEnglish
Article number181913
Pages (from-to)1-3
Number of pages3
JournalApplied Physics Letters
Issue number18
Publication statusPublished - 2005 May 2
Externally publishedYes

ASJC Scopus subject areas

  • Physics and Astronomy (miscellaneous)


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