Novel approach to fabricating carbon nanotube via interconnects using size-controlled catalyst nanoparticles

Shintaro Sato; Mizuhisa Nihei; Atsushi Mimura; Akio Kawabata; Daiyu Kondo; Hiroki Shioya; Taisuke Iwai; Mino Mishima; Mari Ohniti; Yuji Awano

doi:10.1109/IITC.2006.1648696

Novel approach to fabricating carbon nanotube via interconnects using size-controlled catalyst nanoparticles

Shintaro Sato, Mizuhisa Nihei, Atsushi Mimura, Akio Kawabata, Daiyu Kondo, Hiroki Shioya, Taisuke Iwai, Mino Mishima, Mari Ohniti, Yuji Awano

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

97 Citations (Scopus)

Abstract

We propose a new approach to fabricating carbon nanotube (CNT) vias, which uses preformed catalyst nanoparticles to grow CNTs. A newly-designed impactor provided size-classified catalyst particles, and a new deposition system injected them into via holes down to 40 nm in diameter. The resultant CNT-via resistance was 0.59 Ω for 2-μm vias, which is the lowest ever reported, improved from the previous studies using catalyst films. The improvement resulted from higher-density CNTs grown in the via holes by employing the nanoparticle catalyst.

Original language	English
Title of host publication	2006 International Interconnect Technology Conference, IITC
Pages	230-232
Number of pages	3
DOIs	https://doi.org/10.1109/IITC.2006.1648696
Publication status	Published - 2006
Externally published	Yes
Event	2006 International Interconnect Technology Conference, IITC - Burlingame, CA, United States Duration: 2006 Jun 5 → 2006 Jun 7

Publication series

Name	2006 International Interconnect Technology Conference, IITC

Other

Other	2006 International Interconnect Technology Conference, IITC
Country/Territory	United States
City	Burlingame, CA
Period	06/6/5 → 06/6/7

ASJC Scopus subject areas

Control and Systems Engineering
Electrical and Electronic Engineering

Access to Document

10.1109/IITC.2006.1648696

Cite this

Sato, S., Nihei, M., Mimura, A., Kawabata, A., Kondo, D., Shioya, H., Iwai, T., Mishima, M., Ohniti, M., & Awano, Y. (2006). Novel approach to fabricating carbon nanotube via interconnects using size-controlled catalyst nanoparticles. In 2006 International Interconnect Technology Conference, IITC (pp. 230-232). Article 1648696 (2006 International Interconnect Technology Conference, IITC). https://doi.org/10.1109/IITC.2006.1648696

Novel approach to fabricating carbon nanotube via interconnects using size-controlled catalyst nanoparticles. / Sato, Shintaro; Nihei, Mizuhisa; Mimura, Atsushi et al.
2006 International Interconnect Technology Conference, IITC. 2006. p. 230-232 1648696 (2006 International Interconnect Technology Conference, IITC).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Sato, S, Nihei, M, Mimura, A, Kawabata, A, Kondo, D, Shioya, H, Iwai, T, Mishima, M, Ohniti, M & Awano, Y 2006, Novel approach to fabricating carbon nanotube via interconnects using size-controlled catalyst nanoparticles. in 2006 International Interconnect Technology Conference, IITC., 1648696, 2006 International Interconnect Technology Conference, IITC, pp. 230-232, 2006 International Interconnect Technology Conference, IITC, Burlingame, CA, United States, 06/6/5. https://doi.org/10.1109/IITC.2006.1648696

@inproceedings{6ae9ce113bf14700b260ce9f5f71d76f,

title = "Novel approach to fabricating carbon nanotube via interconnects using size-controlled catalyst nanoparticles",

abstract = "We propose a new approach to fabricating carbon nanotube (CNT) vias, which uses preformed catalyst nanoparticles to grow CNTs. A newly-designed impactor provided size-classified catalyst particles, and a new deposition system injected them into via holes down to 40 nm in diameter. The resultant CNT-via resistance was 0.59 Ω for 2-μm vias, which is the lowest ever reported, improved from the previous studies using catalyst films. The improvement resulted from higher-density CNTs grown in the via holes by employing the nanoparticle catalyst.",

author = "Shintaro Sato and Mizuhisa Nihei and Atsushi Mimura and Akio Kawabata and Daiyu Kondo and Hiroki Shioya and Taisuke Iwai and Mino Mishima and Mari Ohniti and Yuji Awano",

year = "2006",

doi = "10.1109/IITC.2006.1648696",

language = "English",

isbn = "1424401038",

series = "2006 International Interconnect Technology Conference, IITC",

pages = "230--232",

booktitle = "2006 International Interconnect Technology Conference, IITC",

note = "2006 International Interconnect Technology Conference, IITC ; Conference date: 05-06-2006 Through 07-06-2006",

}

TY - GEN

T1 - Novel approach to fabricating carbon nanotube via interconnects using size-controlled catalyst nanoparticles

AU - Sato, Shintaro

AU - Nihei, Mizuhisa

AU - Mimura, Atsushi

AU - Kawabata, Akio

AU - Kondo, Daiyu

AU - Shioya, Hiroki

AU - Iwai, Taisuke

AU - Mishima, Mino

AU - Ohniti, Mari

AU - Awano, Yuji

PY - 2006

Y1 - 2006

N2 - We propose a new approach to fabricating carbon nanotube (CNT) vias, which uses preformed catalyst nanoparticles to grow CNTs. A newly-designed impactor provided size-classified catalyst particles, and a new deposition system injected them into via holes down to 40 nm in diameter. The resultant CNT-via resistance was 0.59 Ω for 2-μm vias, which is the lowest ever reported, improved from the previous studies using catalyst films. The improvement resulted from higher-density CNTs grown in the via holes by employing the nanoparticle catalyst.

AB - We propose a new approach to fabricating carbon nanotube (CNT) vias, which uses preformed catalyst nanoparticles to grow CNTs. A newly-designed impactor provided size-classified catalyst particles, and a new deposition system injected them into via holes down to 40 nm in diameter. The resultant CNT-via resistance was 0.59 Ω for 2-μm vias, which is the lowest ever reported, improved from the previous studies using catalyst films. The improvement resulted from higher-density CNTs grown in the via holes by employing the nanoparticle catalyst.

UR - http://www.scopus.com/inward/record.url?scp=36349032609&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=36349032609&partnerID=8YFLogxK

U2 - 10.1109/IITC.2006.1648696

DO - 10.1109/IITC.2006.1648696

M3 - Conference contribution

AN - SCOPUS:36349032609

SN - 1424401038

SN - 9781424401031

T3 - 2006 International Interconnect Technology Conference, IITC

SP - 230

EP - 232

BT - 2006 International Interconnect Technology Conference, IITC

T2 - 2006 International Interconnect Technology Conference, IITC

Y2 - 5 June 2006 through 7 June 2006

ER -

Novel approach to fabricating carbon nanotube via interconnects using size-controlled catalyst nanoparticles

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