On-The-Fly Rapid-Cooling Gelation of Microgel Beads in Centrifugal Microfluidic Device with Liquid Nitrogen

Tomomi Murayama, Mio Tsuchiya, Koki Yoshida, Yuta Kurashina, Hiroaki Onoe

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper describes a new fabrication method of microgel beads crosslinked by rapid temperature change using a centrifugal microfluidic device with a heating system and liquid nitrogen. Previously, materials for fabricating microgel beads with centrifugal microfluidic systems is limited to only sodium alginate solution. By using our proposed method, microgel beads could be fabricated by rapidly cooling pre-gel droplet ejected by centrifugal force. We succeeded in fabricating agarose microgel beads by rapid gelation in the liquid nitrogen. Our fabrication method will expand the variety of materials for the centrifugal microfluidic microgel beads fabrication method and possible applications including biosensors, tissue engineering and drug delivery systems.

Original languageEnglish
Title of host publication34th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2021
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1027-1030
Number of pages4
ISBN (Electronic)9781665419123
DOIs
Publication statusPublished - 2021 Jan 25
Event34th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2021 - Virtual, Gainesville, United States
Duration: 2021 Jan 252021 Jan 29

Publication series

NameProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
Volume2021-January
ISSN (Print)1084-6999

Conference

Conference34th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2021
Country/TerritoryUnited States
CityVirtual, Gainesville
Period21/1/2521/1/29

Keywords

  • Agarose
  • Centrifugal force
  • Gelling by temperature
  • Heater device
  • Microgel beads

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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