TY - GEN
T1 - Performance and Cost Evaluations of Online Sequential Learning and Unsupervised Anomaly Detection Core
AU - Itsubo, Tomoya
AU - Tsukada, Mineto
AU - Matsutani, Hiroki
N1 - Funding Information:
Acknowlegements This work was supported by VDEC, the University of Tokyo in collaboration with Synopsys. References [1] Mineto Tsukada, Masaaki Kondo, and Hiroki Matsutani. OS-ELM-FPGA: An FPGA-Based Online Sequential Unsuper-vised Anomaly Detector. In Proceedings of the International European Conference on Parallel and Distributed Computing (Euro-Par’18) Workshops, pages 518–529, Aug 2018. [2] N. Y. Liang, G. B. Huang, P. Saratchandran, and N. Sundararajan. A Fast and Accurate Online Sequential Learning Algorithm for Feedforward Networks. IEEE Transactions on Neural Networks, 17(6):1411–1423, Nov 2006. [3] G. Hinton and R. Salakhutdinov. Reducing the Dimensionality of Data with Neural Networks. Science, 313(5786):504– 507, Jul 2006.
Publisher Copyright:
© 2019 IEEE.
PY - 2019/5/23
Y1 - 2019/5/23
N2 - Toward on-device learning on IoT devices, this paper implements an online sequential learning and unsupervised anomaly detection core and explores its design options, such as pipeline structure. They are evaluated in terms of performance and cost.
AB - Toward on-device learning on IoT devices, this paper implements an online sequential learning and unsupervised anomaly detection core and explores its design options, such as pipeline structure. They are evaluated in terms of performance and cost.
KW - Machine learning and Pipeline structure)
KW - On-device learning
UR - http://www.scopus.com/inward/record.url?scp=85067121255&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85067121255&partnerID=8YFLogxK
U2 - 10.1109/CoolChips.2019.8721337
DO - 10.1109/CoolChips.2019.8721337
M3 - Conference contribution
AN - SCOPUS:85067121255
T3 - IEEE Symposium on Low-Power and High-Speed Chips and Systems, COOL CHIPS 2019 - Proceedings
BT - IEEE Symposium on Low-Power and High-Speed Chips and Systems, COOL CHIPS 2019 - Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 22nd IEEE Symposium on Low-Power and High-Speed Chips and Systems, COOL CHIPS 2019
Y2 - 17 April 2019 through 19 April 2019
ER -