Self-alignment method on a temperature-controlled transfer

Eiji Iwase, Hiroaki Onoe, Akihito Nakai, Kiyoshi Matsumoto, Isao Shimoyama

Research output: Contribution to journalArticlepeer-review


We propose a method to fix the positioning error of transferred bare chips on a substrate after the Temperature-Controlled Transfer (TCT) that we have previously developed. This TCT method is important for large area integration of heterogeneous materials. In the TCT process, the bare chips on an adhesive sheet are transferred and electrically connected to the substrate via Low-Melting Point Solder (LMPS). We reflowed the LMPS and used the surface tension of the LMPS to self-align the bare chips in position on the substrate. We experimentally confirmed that the self-alignment works when contact pads on the bare chip and the substrate were overlapped. The positioning error after the self-alignment process was within 0-15 % of the contact pad size.

Original languageEnglish
Pages (from-to)188-193+7
Journalieej transactions on sensors and micromachines
Issue number5
Publication statusPublished - 2010 Jun 21
Externally publishedYes


  • Low-melting point solder
  • Poly(ethylene glycol)
  • Self-alignment
  • Temperature-controlled transfer

ASJC Scopus subject areas

  • Mechanical Engineering
  • Electrical and Electronic Engineering


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