TY - GEN
T1 - Shape memory alloy wire actuators for soft, wearable haptic devices
AU - Chernyshov, George
AU - Cao, Feier
AU - Tag, Benjamin
AU - Liu, Gemma
AU - Caremel, Cedric
AU - Kunze, Kai
N1 - Publisher Copyright:
Copyright c 2018 ACM.
PY - 2018/10/8
Y1 - 2018/10/8
N2 - This paper presents a new approach to implement wearable haptic devices using Shape Memory Alloy (SMA) wires. The proposed concept allows building silent, soft, flexible and lightweight wearable devices, capable of producing the sense of pressure on the skin without any bulky mechanical actuators. We explore possible design considerations and applications for such devices, present user studies proving the feasibility of delivering meaningful information and use nonlinear au-toregressive neural networks to compensate for SMA inherent drawbacks, such as delayed onset, enabling us to characterize and predict the physical behavior of the device.
AB - This paper presents a new approach to implement wearable haptic devices using Shape Memory Alloy (SMA) wires. The proposed concept allows building silent, soft, flexible and lightweight wearable devices, capable of producing the sense of pressure on the skin without any bulky mechanical actuators. We explore possible design considerations and applications for such devices, present user studies proving the feasibility of delivering meaningful information and use nonlinear au-toregressive neural networks to compensate for SMA inherent drawbacks, such as delayed onset, enabling us to characterize and predict the physical behavior of the device.
KW - Haptics
KW - Shape Memory Alloys.
KW - Soft Robotics
KW - Wearable Devices
UR - http://www.scopus.com/inward/record.url?scp=85056845945&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85056845945&partnerID=8YFLogxK
U2 - 10.1145/3267242.3267257
DO - 10.1145/3267242.3267257
M3 - Conference contribution
AN - SCOPUS:85056845945
T3 - Proceedings - International Symposium on Wearable Computers, ISWC
SP - 112
EP - 119
BT - ISWC 2018 - Proceedings of the 2018 ACM International Symposium on Wearable Computers
PB - Association for Computing Machinery
T2 - 22nd International Symposium on Wearable Computers, ISWC 2018
Y2 - 8 October 2018 through 12 October 2018
ER -