Shape Retaining and Sacrificial Molding Fabrication Method for ECM-Based in vitro Vascular Model

Jumpei Muramatsu, Wei Huang Goh, Azusa Shimizu, Kenya Hashimoto, Michinao Hashimoto, Shigenori Miura, Hiroaki Onoe

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

This paper describes a new fabrication method for the extracellular matrix (ECM)-based in vitro vascular model. The vascular model was fabricated with shape retaining mold and sacrificial mold (shape retaining and sacrificial molding, SRS-molding). We compared SRS-molding and sacrificial molding. In addition, complex mechanical stimuli such as stretching and flowing in the branches of the vascular model were analyzed by simulation software. Finally, we performed the perfusion culturing with our vascular model and stretching them. Our vascular model and mechanical stimuli analysis would elevate the vascular culturing to the next step.

Original languageEnglish
Title of host publication34th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2021
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages230-233
Number of pages4
ISBN (Electronic)9781665419123
DOIs
Publication statusPublished - 2021 Jan 25
Event34th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2021 - Virtual, Gainesville, United States
Duration: 2021 Jan 252021 Jan 29

Publication series

NameProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
Volume2021-January
ISSN (Print)1084-6999

Conference

Conference34th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2021
Country/TerritoryUnited States
CityVirtual, Gainesville
Period21/1/2521/1/29

Keywords

  • Cell culturing
  • Fluid dynamics
  • Microfluidics
  • Simulation analysis
  • Solid mechanics
  • Tissue engineering

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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