Sintered diamond as a hybrid EDM and grinding tool for the micromachining of single-crystal SiC

Jiwang Yan; Tsong Han Tan

doi:10.1016/j.cirp.2015.04.069

Sintered diamond as a hybrid EDM and grinding tool for the micromachining of single-crystal SiC

Jiwang Yan, Tsong Han Tan

Department of Mechanical Engineering

Research output: Contribution to journal › Article › peer-review

38 Citations (Scopus)

Abstract

Sintered diamond was used as a hybrid tool for micro-scale electrical discharge machining (EDM) and grinding of single-crystal SiC to achieve both high efficiency and surface integrity. Material removal behavior, surface topography, and subsurface damage for both process steps were investigated under various conditions. The results showed that SiC decomposed into Si and C during EDM, creating a very thick recast layer which had remarkably lower hardness than the bulk. Owing to the electrical dressing effect in EDM, diamond grains protrude out of tool surface and grind the recast layer in a ductile manner with low tool wear. An extremely smooth surface (R_a = 1.85 nm) was obtained.

Original language	English
Pages (from-to)	221-224
Number of pages	4
Journal	CIRP Annals - Manufacturing Technology
Volume	64
Issue number	1
DOIs	https://doi.org/10.1016/j.cirp.2015.04.069
Publication status	Published - 2015

Keywords

Electrical discharge machining
Grinding
Sintered diamond

ASJC Scopus subject areas

Mechanical Engineering
Industrial and Manufacturing Engineering

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10.1016/j.cirp.2015.04.069

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title = "Sintered diamond as a hybrid EDM and grinding tool for the micromachining of single-crystal SiC",

abstract = "Sintered diamond was used as a hybrid tool for micro-scale electrical discharge machining (EDM) and grinding of single-crystal SiC to achieve both high efficiency and surface integrity. Material removal behavior, surface topography, and subsurface damage for both process steps were investigated under various conditions. The results showed that SiC decomposed into Si and C during EDM, creating a very thick recast layer which had remarkably lower hardness than the bulk. Owing to the electrical dressing effect in EDM, diamond grains protrude out of tool surface and grind the recast layer in a ductile manner with low tool wear. An extremely smooth surface (Ra = 1.85 nm) was obtained.",

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AU - Yan, Jiwang

AU - Tan, Tsong Han

PY - 2015

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N2 - Sintered diamond was used as a hybrid tool for micro-scale electrical discharge machining (EDM) and grinding of single-crystal SiC to achieve both high efficiency and surface integrity. Material removal behavior, surface topography, and subsurface damage for both process steps were investigated under various conditions. The results showed that SiC decomposed into Si and C during EDM, creating a very thick recast layer which had remarkably lower hardness than the bulk. Owing to the electrical dressing effect in EDM, diamond grains protrude out of tool surface and grind the recast layer in a ductile manner with low tool wear. An extremely smooth surface (Ra = 1.85 nm) was obtained.

AB - Sintered diamond was used as a hybrid tool for micro-scale electrical discharge machining (EDM) and grinding of single-crystal SiC to achieve both high efficiency and surface integrity. Material removal behavior, surface topography, and subsurface damage for both process steps were investigated under various conditions. The results showed that SiC decomposed into Si and C during EDM, creating a very thick recast layer which had remarkably lower hardness than the bulk. Owing to the electrical dressing effect in EDM, diamond grains protrude out of tool surface and grind the recast layer in a ductile manner with low tool wear. An extremely smooth surface (Ra = 1.85 nm) was obtained.

KW - Electrical discharge machining

KW - Grinding

KW - Sintered diamond

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Sintered diamond as a hybrid EDM and grinding tool for the micromachining of single-crystal SiC

Abstract

Keywords

ASJC Scopus subject areas

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