TY - GEN
T1 - Special session on bringing cores closer together
T2 - 36th IEEE VLSI Test Symposium, VTS 2018
AU - Mak, Terrence
AU - Matsutani, Hiroki
AU - Pande, Partha Pratim
N1 - Publisher Copyright:
© 2018 IEEE.
PY - 2018/5/29
Y1 - 2018/5/29
N2 - The emerging field of NoC with Wireless interconnects is actively being pursued by a number of researchers worldwide, from a variety of different perspectives, ranging from very high levels of abstraction (e.g., system architecture) to very low levels (physical layer and transceiver design). Successful solutions will likely adopt and encompass elements from all or at least several levels of abstraction and rely on interdisciplinary concepts from multi-core architectures, integrated circuits, 3D ICs, digital communications, complex networks, and optimization techniques. This special session will provide a timely and insightful journey into various challenges and emerging solutions regarding the design of future NoC architectures. By scope and contents, this special session represents an engaging proposition to attendees belonging to both academia and industry.
AB - The emerging field of NoC with Wireless interconnects is actively being pursued by a number of researchers worldwide, from a variety of different perspectives, ranging from very high levels of abstraction (e.g., system architecture) to very low levels (physical layer and transceiver design). Successful solutions will likely adopt and encompass elements from all or at least several levels of abstraction and rely on interdisciplinary concepts from multi-core architectures, integrated circuits, 3D ICs, digital communications, complex networks, and optimization techniques. This special session will provide a timely and insightful journey into various challenges and emerging solutions regarding the design of future NoC architectures. By scope and contents, this special session represents an engaging proposition to attendees belonging to both academia and industry.
UR - http://www.scopus.com/inward/record.url?scp=85048367027&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85048367027&partnerID=8YFLogxK
U2 - 10.1109/VTS.2018.8368638
DO - 10.1109/VTS.2018.8368638
M3 - Conference contribution
AN - SCOPUS:85048367027
T3 - Proceedings of the IEEE VLSI Test Symposium
SP - 1
BT - Proceedings - 2018 IEEE 36th VLSI Test Symposium, VTS 2018
PB - IEEE Computer Society
Y2 - 22 April 2018 through 25 April 2018
ER -