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Stress and strain analysis using multi-physics solver for power device heat dissipation structures under thermal cycling test
Takahiro Asai, Masaaki Aoki, Akihiro Mochizuki, Takamitsu Honjo, Hitoshi Kida, Goro Yoshinari, Nobuhiko Nakano
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
5
Citations
(Scopus)