Abstract
We present a systematic study of uniaxial/biaxial stress effects on low-field mobility and on-current in high-κ n/pFETs. It is found that mobility enhancement by strain in high-κ FETs is smaller than SiO2 FETs in low effective field because of remote Coulomb scattering caused by fixed charges inside high-κ films, while mobility enhancement by biaxial tensile strain in high-κ nFETs is greater than SiO2 nFETs in high effective field due to weaker surface roughness scattering in high-κ nFETs. In short-channel high-κ nFETs, better on-current improvement by biaxial tensile strain than in SiO2 nFETs is achieved as a result of both higher mobility enhancement and weaker velocity saturation. The optimum stress design for high-κ n/pFETs is also discussed, and it is concluded that the application of transverse tensile stress, in addition to conventional longitudinal stress, is essential for performance improvement of high-κ n/pFETs.
Original language | English |
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Pages (from-to) | 1451-1457 |
Number of pages | 7 |
Journal | IEEE Transactions on Electron Devices |
Volume | 56 |
Issue number | 7 |
DOIs | |
Publication status | Published - 2009 |
Externally published | Yes |
Keywords
- Biaxial stress
- HfSiON
- High-κ
- Mobility
- Remote Coulomb scattering (RCS)
- Short channel
- Strain
- Stress
- Uniaxial stress
- Velocity
- Velocity saturation
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering