Abstract
We have studied Au thin films evaporated on polyethylene naphtalate (PEN) organic substrates as a function of Au thickness < ̃20 nm and discussed its feasibility toward metal/insulator hybrid materials used for quantum cross devices using atomic force microscope. The Au grain size increases from 28.0 ±4.6 nm to 48.5 ±11.4 nm with increasing the Au thickness from 6.9 to 20.8 nm and it denotes that the Au grain size is larger than its Au-thickness size, respectively. The surface roughness of Au films of sub-15-nm thickness, in the scanning scale of the Au-thickness size, is less than 0.9 nm, corresponding to 4-5 atomic layers. These experimental results indicate that Au thin films on PEN substrates are suitable for possible metal/insulator hybrid materials to be used in quantum cross devices.
Original language | English |
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Pages (from-to) | 100-105 |
Number of pages | 6 |
Journal | Materials Research Society Symposium Proceedings |
Volume | 1025 |
Publication status | Published - 2008 Dec 1 |
Externally published | Yes |
Event | Nanoscale Phenomena in Functional Materials by Scanning Probe Microscopy - Boston, MA, United States Duration: 2007 Nov 26 → 2007 Nov 30 |
ASJC Scopus subject areas
- Materials Science(all)
- Condensed Matter Physics
- Mechanics of Materials
- Mechanical Engineering