Abstract
This paper presents a low-power large-capacity ATM switching system design and modules (LSI and MCM). The design uses MCM technology with a copper-polyimide substrate, 150-μm pitch outer lead TAB and 98-highway flexible printed circuit cables for high-density packaging and high-speed operation. Using these technologies, a 160 Gbit/s ATM switching system with a power dissipation of about 1.3 kW can be achieved for future Broadband ISDN systems. This power is 65% of that of the reported system which uses ECL I/Os, and can be cooled by forced air with conventional fin-structures.
Original language | English |
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Pages | 44-47 |
Number of pages | 4 |
Publication status | Published - 1995 |
Externally published | Yes |
Event | Proceedings of the 1995 IEEE/CPMT 18th International Electronic Manufacturing Technology - Omiya, Jpn Duration: 1995 Dec 4 → 1995 Dec 6 |
Other
Other | Proceedings of the 1995 IEEE/CPMT 18th International Electronic Manufacturing Technology |
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City | Omiya, Jpn |
Period | 95/12/4 → 95/12/6 |
ASJC Scopus subject areas
- Industrial and Manufacturing Engineering
- Electrical and Electronic Engineering