Sub-T bit/s large-capacity ATM MCM switching system design and modules with new low-power Gbit/s I/O circuits

Tomoaki Kawamura; Naoaki Yamanaka; Tsuneo Matsumura; Haruhiko Ichino; Chikara Yamaguchi; Yoshiji Kobayashi

Sub-T bit/s large-capacity ATM MCM switching system design and modules with new low-power Gbit/s I/O circuits

Tomoaki Kawamura, Naoaki Yamanaka, Tsuneo Matsumura, Haruhiko Ichino, Chikara Yamaguchi, Yoshiji Kobayashi

Research output: Contribution to conference › Paper › peer-review

Abstract

This paper presents a low-power large-capacity ATM switching system design and modules (LSI and MCM). The design uses MCM technology with a copper-polyimide substrate, 150-μm pitch outer lead TAB and 98-highway flexible printed circuit cables for high-density packaging and high-speed operation. Using these technologies, a 160 Gbit/s ATM switching system with a power dissipation of about 1.3 kW can be achieved for future Broadband ISDN systems. This power is 65% of that of the reported system which uses ECL I/Os, and can be cooled by forced air with conventional fin-structures.

Original language	English
Pages	44-47
Number of pages	4
Publication status	Published - 1995
Externally published	Yes
Event	Proceedings of the 1995 IEEE/CPMT 18th International Electronic Manufacturing Technology - Omiya, Jpn Duration: 1995 Dec 4 → 1995 Dec 6

Other

Other	Proceedings of the 1995 IEEE/CPMT 18th International Electronic Manufacturing Technology
City	Omiya, Jpn
Period	95/12/4 → 95/12/6

ASJC Scopus subject areas

Industrial and Manufacturing Engineering
Electrical and Electronic Engineering

Cite this

Sub-T bit/s large-capacity ATM MCM switching system design and modules with new low-power Gbit/s I/O circuits. / Kawamura, Tomoaki; Yamanaka, Naoaki; Matsumura, Tsuneo et al.
1995. 44-47 Paper presented at Proceedings of the 1995 IEEE/CPMT 18th International Electronic Manufacturing Technology, Omiya, Jpn.

Research output: Contribution to conference › Paper › peer-review

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title = "Sub-T bit/s large-capacity ATM MCM switching system design and modules with new low-power Gbit/s I/O circuits",

abstract = "This paper presents a low-power large-capacity ATM switching system design and modules (LSI and MCM). The design uses MCM technology with a copper-polyimide substrate, 150-μm pitch outer lead TAB and 98-highway flexible printed circuit cables for high-density packaging and high-speed operation. Using these technologies, a 160 Gbit/s ATM switching system with a power dissipation of about 1.3 kW can be achieved for future Broadband ISDN systems. This power is 65% of that of the reported system which uses ECL I/Os, and can be cooled by forced air with conventional fin-structures.",

author = "Tomoaki Kawamura and Naoaki Yamanaka and Tsuneo Matsumura and Haruhiko Ichino and Chikara Yamaguchi and Yoshiji Kobayashi",

year = "1995",

language = "English",

pages = "44--47",

note = "Proceedings of the 1995 IEEE/CPMT 18th International Electronic Manufacturing Technology ; Conference date: 04-12-1995 Through 06-12-1995",

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T1 - Sub-T bit/s large-capacity ATM MCM switching system design and modules with new low-power Gbit/s I/O circuits

AU - Kawamura, Tomoaki

AU - Yamanaka, Naoaki

AU - Matsumura, Tsuneo

AU - Ichino, Haruhiko

AU - Yamaguchi, Chikara

AU - Kobayashi, Yoshiji

PY - 1995

Y1 - 1995

N2 - This paper presents a low-power large-capacity ATM switching system design and modules (LSI and MCM). The design uses MCM technology with a copper-polyimide substrate, 150-μm pitch outer lead TAB and 98-highway flexible printed circuit cables for high-density packaging and high-speed operation. Using these technologies, a 160 Gbit/s ATM switching system with a power dissipation of about 1.3 kW can be achieved for future Broadband ISDN systems. This power is 65% of that of the reported system which uses ECL I/Os, and can be cooled by forced air with conventional fin-structures.

AB - This paper presents a low-power large-capacity ATM switching system design and modules (LSI and MCM). The design uses MCM technology with a copper-polyimide substrate, 150-μm pitch outer lead TAB and 98-highway flexible printed circuit cables for high-density packaging and high-speed operation. Using these technologies, a 160 Gbit/s ATM switching system with a power dissipation of about 1.3 kW can be achieved for future Broadband ISDN systems. This power is 65% of that of the reported system which uses ECL I/Os, and can be cooled by forced air with conventional fin-structures.

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M3 - Paper

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T2 - Proceedings of the 1995 IEEE/CPMT 18th International Electronic Manufacturing Technology

Y2 - 4 December 1995 through 6 December 1995

ER -

Sub-T bit/s large-capacity ATM MCM switching system design and modules with new low-power Gbit/s I/O circuits

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ASJC Scopus subject areas

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