Abstract
With the growth of Internet-based services, data centers must deal with increasing data traffic. Load-balancing technologies can help data centers process data effectively and stably; however, the current load-balancing methods do not take into account the heat generated by servers. Excessive heat can increase the failure rate of IT devices and the energy consumption of air conditioning systems, both of which lead to higher data center maintenance costs. This paper aims to simultaneously increase the coefficient of performance (COP) of the data center's air-conditioning equipment and decrease the semiconductor-based equipment failure rate. To do so-and, consequently, reduce the operation and maintenance costs-we propose a novel request distribution system based on servertemperature and evaluate the proposed system by creating a thermal model of a data center. As a result, it is suggested that using the proposed load-balancing method the semiconductor failure rate can be reduced by 32 % when compared with the common round-robin distribution method, and by 19 % when compared with a load-balancing method based on CPU utilization. Moreover, the COP of the air-conditioning equipment obtained with the proposed method is recognized to be higher than those obtained with either the round-robin or the CPUutilization- based methods.
Original language | English |
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Title of host publication | ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2017, collocated with the ASME 2017 Conference on Information Storage and Processing Systems |
Publisher | American Society of Mechanical Engineers |
ISBN (Electronic) | 9780791858097 |
DOIs | |
Publication status | Published - 2017 Jan 1 |
Event | ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2017, collocated with the ASME 2017 Conference on Information Storage and Processing Systems - San Francisco, United States Duration: 2017 Aug 29 → 2017 Sept 1 |
Other
Other | ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2017, collocated with the ASME 2017 Conference on Information Storage and Processing Systems |
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Country/Territory | United States |
City | San Francisco |
Period | 17/8/29 → 17/9/1 |
Keywords
- Data center
- Load balancing
- Simulation
- Thermal modeling
ASJC Scopus subject areas
- Hardware and Architecture
- Electrical and Electronic Engineering