TY - GEN
T1 - Temperature control on a curved surface for implementing to wearable interfaces
AU - Osawa, Yukiko
AU - Katsura, Seiichiro
N1 - Publisher Copyright:
© 2016 IEEE.
PY - 2016/12/21
Y1 - 2016/12/21
N2 - Recently, tactile transmission utilizing wearable devices are necessary to support human life or communicating with people in remote locations. One key factor of transmitting tactile sensation is thermal sensation. Flexible thermal devices have been developed, however, precise temperature distribution cannot be reproduced due to the large size and the flexibility of the devices. Therefore, a technique of rendering thermal sensation considering heat propagation is required to obtain the desired temperature distribution. In this paper, a method to control temperature on a curved surface for implementing to wearable devices is proposed. This method can be applied to various shapes of devices because the deformation of a device can be observed by the propagation delay of the heat flow. Experiments are conducted to verify the validity of the proposed method.
AB - Recently, tactile transmission utilizing wearable devices are necessary to support human life or communicating with people in remote locations. One key factor of transmitting tactile sensation is thermal sensation. Flexible thermal devices have been developed, however, precise temperature distribution cannot be reproduced due to the large size and the flexibility of the devices. Therefore, a technique of rendering thermal sensation considering heat propagation is required to obtain the desired temperature distribution. In this paper, a method to control temperature on a curved surface for implementing to wearable devices is proposed. This method can be applied to various shapes of devices because the deformation of a device can be observed by the propagation delay of the heat flow. Experiments are conducted to verify the validity of the proposed method.
UR - http://www.scopus.com/inward/record.url?scp=85010063082&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85010063082&partnerID=8YFLogxK
U2 - 10.1109/IECON.2016.7793865
DO - 10.1109/IECON.2016.7793865
M3 - Conference contribution
AN - SCOPUS:85010063082
T3 - IECON Proceedings (Industrial Electronics Conference)
SP - 348
EP - 353
BT - Proceedings of the IECON 2016 - 42nd Annual Conference of the Industrial Electronics Society
PB - IEEE Computer Society
T2 - 42nd Conference of the Industrial Electronics Society, IECON 2016
Y2 - 24 October 2016 through 27 October 2016
ER -