TY - GEN
T1 - Temperature-controlled transfer and self-wiring for multi-color led display on a flexible substrate
AU - Iwase, Eiji
AU - Onoe, Hiroaki
AU - Nakai, Akihito
AU - Matsumoto, Kiyoshi
AU - Shimoyama, Isao
PY - 2009/1/1
Y1 - 2009/1/1
N2 - We propose an integration method for arranging LED bare chips on a flexible substrate to fabricate a multi-color LED display. LED chips (240 μm × 240 μm × 75 μm) which were arrayed on an adhesive sheet were transferred to a flexible circuit substrate using our temperature-controlled transfer (TCT) and self-wiring (SW) method. Using these methods, we demonstrated a 5-by-5 LED flexible device and a two-color (blue and green) LED device, and observed light emission from the LED chips.
AB - We propose an integration method for arranging LED bare chips on a flexible substrate to fabricate a multi-color LED display. LED chips (240 μm × 240 μm × 75 μm) which were arrayed on an adhesive sheet were transferred to a flexible circuit substrate using our temperature-controlled transfer (TCT) and self-wiring (SW) method. Using these methods, we demonstrated a 5-by-5 LED flexible device and a two-color (blue and green) LED device, and observed light emission from the LED chips.
UR - http://www.scopus.com/inward/record.url?scp=65949097973&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=65949097973&partnerID=8YFLogxK
U2 - 10.1109/MEMSYS.2009.4805347
DO - 10.1109/MEMSYS.2009.4805347
M3 - Conference contribution
AN - SCOPUS:65949097973
SN - 9781424429776
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 176
EP - 179
BT - 22nd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2009
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 22nd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2009
Y2 - 25 January 2009 through 29 January 2009
ER -