TY - GEN
T1 - Thruchip interface for heterogeneous chip stacking
AU - Kuroda, Tadahiro
PY - 2013
Y1 - 2013
N2 - This paper presents a wireless inter-chip link using inductive coupling, namely ThruChip Interface (TCI). TCI is a digital CMOS circuit solution in a standard CMOS technology. It is much less expensive than TSV (Through Silicon Via) but bears comparison in performance. Delay time and energy dissipation will scale down by scaling device size and chip thickness. As the inductive coupling enables interface among chips under different supply voltages, TCI is suitable for heterogeneous integration. A 90nm 8- core processor under 1.0V power supply and two 65nm SRAM's under 1.2V power supply are stacked and AC-coupled by TCI at 19.2Gb/s. Power dissipation and area efficiency of the link is 1pJ/b and 0.15mm2/Gbps respectively, which is 1/30 and 1/3 in comparison with the conventional DDR2 interface.
AB - This paper presents a wireless inter-chip link using inductive coupling, namely ThruChip Interface (TCI). TCI is a digital CMOS circuit solution in a standard CMOS technology. It is much less expensive than TSV (Through Silicon Via) but bears comparison in performance. Delay time and energy dissipation will scale down by scaling device size and chip thickness. As the inductive coupling enables interface among chips under different supply voltages, TCI is suitable for heterogeneous integration. A 90nm 8- core processor under 1.0V power supply and two 65nm SRAM's under 1.2V power supply are stacked and AC-coupled by TCI at 19.2Gb/s. Power dissipation and area efficiency of the link is 1pJ/b and 0.15mm2/Gbps respectively, which is 1/30 and 1/3 in comparison with the conventional DDR2 interface.
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U2 - 10.1149/05014.0063ecst
DO - 10.1149/05014.0063ecst
M3 - Conference contribution
AN - SCOPUS:84885796163
SN - 9781623320133
T3 - ECS Transactions
SP - 63
EP - 68
BT - International Symposium on Functional Diversification of Semiconductor Electronics
PB - Electrochemical Society Inc.
T2 - Symposium on More than Moore - 222nd ECS Meeting/PRiME 2012
Y2 - 7 October 2012 through 12 October 2012
ER -