ThruChip Interface (TCI) for 3D integration of low-power system

Tadahiro Kuroda

doi:10.1109/IEDM.2010.5703378

ThruChip Interface (TCI) for 3D integration of low-power system

Tadahiro Kuroda

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Citations (Scopus)

Abstract

This paper presents a counterpart of TSV and a circuit solution that enables 3D integration of power-aware systems. It bears comparison with TSV in performance but less expensive.

Original language	English
Title of host publication	2010 IEEE International Electron Devices Meeting, IEDM 2010
Pages	17.1.1
DOIs	https://doi.org/10.1109/IEDM.2010.5703378
Publication status	Published - 2010 Dec 1
Event	2010 IEEE International Electron Devices Meeting, IEDM 2010 - San Francisco, CA, United States Duration: 2010 Dec 6 → 2010 Dec 8

Publication series

Name	Technical Digest - International Electron Devices Meeting, IEDM
ISSN (Print)	0163-1918

Other

Other	2010 IEEE International Electron Devices Meeting, IEDM 2010
Country/Territory	United States
City	San Francisco, CA
Period	10/12/6 → 10/12/8

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Electrical and Electronic Engineering
Materials Chemistry

Access to Document

10.1109/IEDM.2010.5703378

Cite this

Kuroda, T 2010, ThruChip Interface (TCI) for 3D integration of low-power system. in 2010 IEEE International Electron Devices Meeting, IEDM 2010., 5703378, Technical Digest - International Electron Devices Meeting, IEDM, pp. 17.1.1, 2010 IEEE International Electron Devices Meeting, IEDM 2010, San Francisco, CA, United States, 10/12/6. https://doi.org/10.1109/IEDM.2010.5703378

@inproceedings{0345d06420334f279703e8d8d6989c5a,

title = "ThruChip Interface (TCI) for 3D integration of low-power system",

abstract = "This paper presents a counterpart of TSV and a circuit solution that enables 3D integration of power-aware systems. It bears comparison with TSV in performance but less expensive.",

author = "Tadahiro Kuroda",

year = "2010",

month = dec,

day = "1",

doi = "10.1109/IEDM.2010.5703378",

language = "English",

isbn = "9781424474196",

series = "Technical Digest - International Electron Devices Meeting, IEDM",

pages = "17.1.1",

booktitle = "2010 IEEE International Electron Devices Meeting, IEDM 2010",

note = "2010 IEEE International Electron Devices Meeting, IEDM 2010 ; Conference date: 06-12-2010 Through 08-12-2010",

}

TY - GEN

T1 - ThruChip Interface (TCI) for 3D integration of low-power system

AU - Kuroda, Tadahiro

PY - 2010/12/1

Y1 - 2010/12/1

N2 - This paper presents a counterpart of TSV and a circuit solution that enables 3D integration of power-aware systems. It bears comparison with TSV in performance but less expensive.

AB - This paper presents a counterpart of TSV and a circuit solution that enables 3D integration of power-aware systems. It bears comparison with TSV in performance but less expensive.

UR - http://www.scopus.com/inward/record.url?scp=79951839481&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=79951839481&partnerID=8YFLogxK

U2 - 10.1109/IEDM.2010.5703378

DO - 10.1109/IEDM.2010.5703378

M3 - Conference contribution

AN - SCOPUS:79951839481

SN - 9781424474196

T3 - Technical Digest - International Electron Devices Meeting, IEDM

SP - 17.1.1

BT - 2010 IEEE International Electron Devices Meeting, IEDM 2010

T2 - 2010 IEEE International Electron Devices Meeting, IEDM 2010

Y2 - 6 December 2010 through 8 December 2010

ER -

ThruChip Interface (TCI) for 3D integration of low-power system

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