ThruChip interface (TCI) for 3D networks on chip

Tadahiro Kuroda

doi:10.1109/VLSISoC.2011.6081644

ThruChip interface (TCI) for 3D networks on chip

Tadahiro Kuroda

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

11 Citations (Scopus)

Abstract

This paper presents a wireless interconnection for 3D Networks on Chip, namely ThruChip Interface (TCI). TCI employs near field inductive coupling that is suitable for high-density parallel channel arrangement with small cross talk. It is less expensive than TSV by over 20¢/chip, since it is implemented by digital circuits in a standard CMOS. It bears comparison with TSV in terms of data rate (10Gb/s/ch), reliability (BER<10-14), and energy dissipation (0.1pJ/b). ESD protection devices can be eliminated to lower delay, power, and area. It provides with an AC coupling link to make interface design easy under multiple/variable VDD's. The cost/performance will further be improved exponentially by thinning chip thickness. This talk will cover basics, applications, and future perspectives of the TCI.

Original language	English
Title of host publication	2011 IEEE/IFIP 19th International Conference on VLSI and System-on-Chip, VLSI-SoC 2011
Pages	238-241
Number of pages	4
DOIs	https://doi.org/10.1109/VLSISoC.2011.6081644
Publication status	Published - 2011
Event	2011 IEEE/IFIP 19th International Conference on VLSI and System-on-Chip, VLSI-SoC 2011 - Kowloon, Hong Kong Duration: 2011 Oct 3 → 2011 Oct 5

Publication series

Name	2011 IEEE/IFIP 19th International Conference on VLSI and System-on-Chip, VLSI-SoC 2011

Other

Other	2011 IEEE/IFIP 19th International Conference on VLSI and System-on-Chip, VLSI-SoC 2011
Country/Territory	Hong Kong
City	Kowloon
Period	11/10/3 → 11/10/5

ASJC Scopus subject areas

Hardware and Architecture
Electrical and Electronic Engineering

Access to Document

10.1109/VLSISoC.2011.6081644

Cite this

Kuroda, T 2011, ThruChip interface (TCI) for 3D networks on chip. in 2011 IEEE/IFIP 19th International Conference on VLSI and System-on-Chip, VLSI-SoC 2011., 6081644, 2011 IEEE/IFIP 19th International Conference on VLSI and System-on-Chip, VLSI-SoC 2011, pp. 238-241, 2011 IEEE/IFIP 19th International Conference on VLSI and System-on-Chip, VLSI-SoC 2011, Kowloon, Hong Kong, 11/10/3. https://doi.org/10.1109/VLSISoC.2011.6081644

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abstract = "This paper presents a wireless interconnection for 3D Networks on Chip, namely ThruChip Interface (TCI). TCI employs near field inductive coupling that is suitable for high-density parallel channel arrangement with small cross talk. It is less expensive than TSV by over 20¢/chip, since it is implemented by digital circuits in a standard CMOS. It bears comparison with TSV in terms of data rate (10Gb/s/ch), reliability (BER<10-14), and energy dissipation (0.1pJ/b). ESD protection devices can be eliminated to lower delay, power, and area. It provides with an AC coupling link to make interface design easy under multiple/variable VDD's. The cost/performance will further be improved exponentially by thinning chip thickness. This talk will cover basics, applications, and future perspectives of the TCI.",

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ER -

ThruChip interface (TCI) for 3D networks on chip

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