Tightly-coupled multi-layer topologies for 3-D NoCs

Keyphrases

• Tightly Coupled 100%
• Connected Network 100%
• NoCs 100%
• Three-dimensional Network-on-chip 50%
• Crossbar Switch 50%
• Wafer 50%
• Cost Performance 50%
• 3D Topology 50%
• Network Layer 25%
• Heat Sink 25%
• Deadlock Freedom 25%
• Cost Consumption 25%
• Heat Dissipation 25%
• Network Connectivity 25%
• Performance Requirements 25%
• Wirelength 25%
• Multiplex Networks 25%
• Routing Algorithm 25%
• Path Set 25%
• Emerging Research Topics 25%
• Wire Delay 25%
• Planar Topology 25%
• Chip Size 25%

Engineering

• Cost Performance 100%
• Layer Network 50%
• Heat Losses 50%
• Network Connectivity 50%
• Performance Requirement 50%
• Energy Performance 50%
• Routing Algorithm 50%
• Cross Bar 50%

Computer Science

• Connected Network 100%
• Crossbar Switch 50%
• Energy Consumption 25%
• Routing Algorithm 25%
• Deadlock Freedom 25%
• Multiple Network 25%
• Network Connectivity 25%
• Performance Requirement 25%
• Network Layer 25%