Ultrasound-Triggered Drug Release from Hydrogel Microspheres with Release Booster

Takeshi Kubota, Yuta Kurashina, Hiroaki Onoe

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper describes ultrasound-triggered drug release from hydrogel microspheres with release booster. As a drug carrier, calcium alginate hydrogel microspheres containing drug model and tungsten particles were fabricated by using a centrifugal microfluidic device. The tungsten particles with high acoustic impedance enable the hydrogel microspheres to have high sensitivity to ultrasound so that the release rate of the drug models improves. By applying ultrasound to the hydrogel microspheres, we confirmed the release of fluorescent silica nanoparticles and protein as a drug model. Importantly, the drug model was released from our hydrogel microspheres even in a cavitation-suppressed environment, indicating that this system could reduce the damage to tissues. Our proposed ultrasound-triggered drug release system using tungsten particles would be an effective on-demand drug delivery system (DDS).

Original languageEnglish
Title of host publication34th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2021
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages26-29
Number of pages4
ISBN (Electronic)9781665419123
DOIs
Publication statusPublished - 2021 Jan 25
Event34th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2021 - Virtual, Gainesville, United States
Duration: 2021 Jan 252021 Jan 29

Publication series

NameProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
Volume2021-January
ISSN (Print)1084-6999

Conference

Conference34th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2021
Country/TerritoryUnited States
CityVirtual, Gainesville
Period21/1/2521/1/29

Keywords

  • Acoustic impedance
  • Drug release
  • Hydrogel microspheres
  • Ultrasound

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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