TY - GEN
T1 - Ultrathin, short channel, thermally-stable organic transistors for neural interface systems
AU - Reuveny, Amir
AU - Yokota, Tomoyuki
AU - Koizumi, Mari
AU - Kaltenbrunner, Martin
AU - Matsuhisa, Naoji
AU - Sekitani, Tsuyoshi
AU - Someya, Takao
PY - 2014/12/9
Y1 - 2014/12/9
N2 - We present here design and fabrication of short channel organic thin film transistor with uniform performance and good thermal stability for utilization in neural interface systems. Transistors are fabricated on ultra-thin parylene diX-SR substrate which provides great flexibility and conformability to curvilinear surfaces. With channel length as short as 2μm, transistors show low contact resistance and good mobility in bottom contact architecture for higher operating frequencies. As a crucial factor for sterilization, our transistors demonstrate excellent thermal stability and remain functional up to 170°C. The low operating voltage and their heat durability prospect those devices to serve as an efficient interface to the complex texture of brain tissue for future applications.
AB - We present here design and fabrication of short channel organic thin film transistor with uniform performance and good thermal stability for utilization in neural interface systems. Transistors are fabricated on ultra-thin parylene diX-SR substrate which provides great flexibility and conformability to curvilinear surfaces. With channel length as short as 2μm, transistors show low contact resistance and good mobility in bottom contact architecture for higher operating frequencies. As a crucial factor for sterilization, our transistors demonstrate excellent thermal stability and remain functional up to 170°C. The low operating voltage and their heat durability prospect those devices to serve as an efficient interface to the complex texture of brain tissue for future applications.
KW - frequency response
KW - neural interface systems
KW - organic thin film transistors
KW - parylene
KW - thermal stability
UR - http://www.scopus.com/inward/record.url?scp=84920506857&partnerID=8YFLogxK
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U2 - 10.1109/BioCAS.2014.6981791
DO - 10.1109/BioCAS.2014.6981791
M3 - Conference contribution
AN - SCOPUS:84920506857
T3 - IEEE 2014 Biomedical Circuits and Systems Conference, BioCAS 2014 - Proceedings
SP - 576
EP - 579
BT - IEEE 2014 Biomedical Circuits and Systems Conference, BioCAS 2014 - Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 10th IEEE Biomedical Circuits and Systems Conference, BioCAS 2014
Y2 - 22 October 2014 through 24 October 2014
ER -