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Warpage and Thermal Stress under Thermal Cycling Test in SiC and Si Power Device Structures Using Direct Chip-Bonding with Ag Sintered Layer on Cu Plate

  • Masaki Kanemoto
  • , Masaaki Aoki
  • , Akihiro Mochizuki
  • , Yoshio Murakami
  • , Mutsuharu Tsunoda
  • , Nobuhiko Nakano

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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