Wire bonding over insulating substrates by electropolymerization of polypyrrole using a scanning micro-needle

Seimei Sha Shiratori; Seiji Mori; Kazuo Ikezaki

doi:10.1016/S0925-4005(97)00338-9

Wire bonding over insulating substrates by electropolymerization of polypyrrole using a scanning micro-needle

Seimei Sha Shiratori, Seiji Mori, Kazuo Ikezaki

Department of Applied Physics and Physico-Informatics

Research output: Contribution to journal › Article › peer-review

23 Citations (Scopus)

Abstract

Electrically conducting wires 10-200 μm in diameter were controllably formed over electrically insulating substrates by electropolymerization of a conducting polymer using a scanning micro-needle. The conductivity of the wire was estimated from the I-V characteristics to be about 0.5-200 S cm^-1 which is not inferior to the reported conductivity of an electrochemically polymerized polypyrrole (PPy) film. Wires were formed like bridges between two conducting electrodes over glass substrates. This technique can be used for wire bonding of elements or electrodes.

Original language	English
Pages (from-to)	30-33
Number of pages	4
Journal	Sensors and Actuators, B: Chemical
Volume	49
Issue number	1-2
DOIs	https://doi.org/10.1016/S0925-4005(97)00338-9
Publication status	Published - 1998 Jun 25

Keywords

Electropolymerization
Micro-needle
Polypyrrole
Wire bonding

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Instrumentation
Condensed Matter Physics
Surfaces, Coatings and Films
Metals and Alloys
Electrical and Electronic Engineering
Materials Chemistry

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10.1016/S0925-4005(97)00338-9

Cite this

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abstract = "Electrically conducting wires 10-200 μm in diameter were controllably formed over electrically insulating substrates by electropolymerization of a conducting polymer using a scanning micro-needle. The conductivity of the wire was estimated from the I-V characteristics to be about 0.5-200 S cm-1 which is not inferior to the reported conductivity of an electrochemically polymerized polypyrrole (PPy) film. Wires were formed like bridges between two conducting electrodes over glass substrates. This technique can be used for wire bonding of elements or electrodes.",

keywords = "Electropolymerization, Micro-needle, Polypyrrole, Wire bonding",

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AU - Shiratori, Seimei Sha

AU - Mori, Seiji

AU - Ikezaki, Kazuo

N1 - Funding Information: The authors thank Professor M.F. Rubner and Mr Michael Durstock of the Massachusetts Institute of Technology in the USA for their important advice and comments on this study. A part of this work was supported by a Grant-in-Aid from the Yazaki Foundation for the promotion of Science and Engineering.

PY - 1998/6/25

Y1 - 1998/6/25

N2 - Electrically conducting wires 10-200 μm in diameter were controllably formed over electrically insulating substrates by electropolymerization of a conducting polymer using a scanning micro-needle. The conductivity of the wire was estimated from the I-V characteristics to be about 0.5-200 S cm-1 which is not inferior to the reported conductivity of an electrochemically polymerized polypyrrole (PPy) film. Wires were formed like bridges between two conducting electrodes over glass substrates. This technique can be used for wire bonding of elements or electrodes.

AB - Electrically conducting wires 10-200 μm in diameter were controllably formed over electrically insulating substrates by electropolymerization of a conducting polymer using a scanning micro-needle. The conductivity of the wire was estimated from the I-V characteristics to be about 0.5-200 S cm-1 which is not inferior to the reported conductivity of an electrochemically polymerized polypyrrole (PPy) film. Wires were formed like bridges between two conducting electrodes over glass substrates. This technique can be used for wire bonding of elements or electrodes.

KW - Electropolymerization

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KW - Wire bonding

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Wire bonding over insulating substrates by electropolymerization of polypyrrole using a scanning micro-needle

Abstract

Keywords

ASJC Scopus subject areas

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