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Scopus著者プロファイル
閻 紀旺
機械工学科
ウェブサイト
https://k-ris.keio.ac.jp/html/100011315_ja.html
h-index
8532
被引用数
50
h 指数
Pureの文献数とScopusの被引用数に基づいて算出されます
1994 …
2025
年別の研究成果
概要
フィンガープリント
ネットワーク
研究成果
(386)
類似のプロファイル
(4)
フィンガープリント
Jiwang Yanが活動している研究トピックを掘り下げます。このトピックラベルは、この研究者の研究成果に基づきます。これらがまとまってユニークなフィンガープリントを構成します。
並べ替え順
重み付け
アルファベット順
Material Science
Diamond
100%
Amorphous Metal
90%
Nanoindentation
86%
Single Crystal
72%
Machining
72%
Silicon
70%
Surface Roughness
69%
Silicon Carbide
47%
Indentation
37%
Amorphous Material
31%
Powder
31%
Surface Property
30%
Silicon Wafer
29%
Laser Pulse
28%
Crystalline Material
28%
Machinability
25%
Nanocrystalline Material
24%
Yttria Stabilized Zirconia
21%
Brittleness
20%
Electrical Discharge Machining
20%
Wettability
18%
Surface Morphology
18%
Shear Band
17%
Nitriding
17%
Residual Stress
16%
X-Ray Diffraction
16%
Zirconia
15%
Scanning Electron Microscopy
15%
Finite Element Method
14%
Carbide
14%
Germanium
14%
High Entropy Alloys
14%
Tungsten
13%
Wear Resistance
13%
Optical Device
12%
Laser Ablation
12%
Surface Property
12%
Thin Films
12%
Carbon Nanofiber
12%
Anisotropy
12%
Polishing
12%
Bulk Metallic Glass
12%
Magnetron Sputtering
11%
Surface (Surface Science)
11%
Crystal Orientation
11%
Aluminum Oxide
11%
Surface Patterning
10%
X-Ray Photoelectron Spectroscopy
10%
Microhardness
10%
Optical Glass
10%
Engineering
Laser Irradiation
78%
Diamond Turning
70%
Diamond
64%
Nanosecond
60%
Pulsed Laser
57%
Subsurface
46%
Grinding (Machining)
44%
Silicon Single Crystal
43%
Diamond Tool
35%
Microstructure
35%
Brittle Material
33%
Form Accuracy
31%
Surface Integrity
29%
Experimental Result
26%
Silicon Wafer
25%
Ultrasonics
25%
Electrical Discharge
25%
Machined Surface
24%
Micro-Lens Array
23%
Ground Surface
22%
Microgrooves
22%
Ductile Mode
22%
Glass Surface
21%
Polycrystalline
21%
Electric Discharge Machining
20%
Cutting Edge
19%
Ductile Machining
19%
Indentation
17%
Surface Quality
17%
Material Removal
17%
Form Error
16%
Surface Morphology
15%
Induced Periodic Surface Structure
15%
Abrasive Grain
15%
Crystalline Silicon
14%
Service Life
13%
Chip Thickness
13%
Transmissions
12%
Laser Parameter
12%
Fused Silica
12%
Nanoscale
12%
Cutting Force
12%
Cutting Speed
12%
Grinding Wheel
12%
Crystal Grain
12%
Laser Micro
11%
Nanometre
11%
Feed Rate
11%
Nanotopography
10%
Crack Resistance
10%
Keyphrases
Nanoindentation
13%
Machining Characteristics
12%
Germanium
12%
Ductile Machining
11%
Ultra-precision Diamond Turning
10%
Fluorite
9%
Diamond Turning
9%
Multicrystalline Silicon
9%
Single Crystal Germanium
9%
Microgroove
8%
Diamond Tool
8%
Soft Brittle Material
7%
Silicon Wafer
7%
Single-crystal Calcium Fluoride
7%
Depth of Cut
7%
Ultra-precision Machining
7%
Micro-ultrasonic Machining
7%
Diamond
7%
Feed Rate
7%
Zr-based Metallic Glass
7%
Machining Technology
7%
Fused Silica
7%
Slant Feed Grinding
7%
Edge Truncation
7%
Glass Molding Press
7%
Fresnel Lens
7%
Nano-precision
7%
Microcrystalline Quartz
7%
Materials for Optical Devices
7%
Optical Glass
7%
Wheel Wear
7%
Ground Surface Roughness
7%
Compound Semiconductors
7%
Nonisothermal Glass Molding
7%
Single-crystal CaF2
7%
Surface Roughness
6%
Ultra-precision
6%
Ductile Mode
6%
Grooving Method
6%
Metallic Glass
6%
Cutting Speed
6%
Single-crystal Diamond Tool
6%
Nanoindentation Test
6%
Dislocation
6%
Press Molding
6%
Abrasive Grain
5%
Subsurface Damage
5%
Surface Formation Mechanism
5%
Laser Irradiation
5%
Indentation
5%
