TY - GEN
T1 - 3D Printed Micro Force Plate for Measuring the Ground Reaction Force of a Fruit Fly
AU - Sugimoto, Takumi
AU - Toda, Hirofumi
AU - Takahashi, Hidetoshi
N1 - Funding Information:
This research was supported by JSPS KAKENHI Grant No. 20K20984.
Publisher Copyright:
© 2022 IEEE.
PY - 2022
Y1 - 2022
N2 - This paper reports on a micro force plate for a fruit fly, which is fabricated by a high-resolution 3D printer. The conventional force sensors for tiny insects were highly sensitive but fragile and took much time to be fabricated. The proposed force plate achieves both high sensitivity and toughness via completely 3D supporting micro-springs and an external laser displacement meter. The plate structure integrated with the micro-springs is easily and reproducibly printed in a single process. When a fruit fly lands on a plate surface, the ground reaction force (GRF) is measured with force resolution less than 1/50 of the body weight from the plate displacement via the laser displacement meter. Our proposed device is helpful to evaluate the biomechanics of tiny insects.
AB - This paper reports on a micro force plate for a fruit fly, which is fabricated by a high-resolution 3D printer. The conventional force sensors for tiny insects were highly sensitive but fragile and took much time to be fabricated. The proposed force plate achieves both high sensitivity and toughness via completely 3D supporting micro-springs and an external laser displacement meter. The plate structure integrated with the micro-springs is easily and reproducibly printed in a single process. When a fruit fly lands on a plate surface, the ground reaction force (GRF) is measured with force resolution less than 1/50 of the body weight from the plate displacement via the laser displacement meter. Our proposed device is helpful to evaluate the biomechanics of tiny insects.
KW - Displacement sensors
KW - Force plate
KW - Fruit fly
KW - Ground reaction force
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U2 - 10.1109/MEMS51670.2022.9699472
DO - 10.1109/MEMS51670.2022.9699472
M3 - Conference contribution
AN - SCOPUS:85126396582
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 703
EP - 705
BT - 35th IEEE International Conference on Micro Electro Mechanical Systems Conference, MEMS 2022
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 35th IEEE International Conference on Micro Electro Mechanical Systems Conference, MEMS 2022
Y2 - 9 January 2022 through 13 January 2022
ER -