3D stacked imager featuring inductive coupling channels for high speed/low-noise image transfer

Masayuki Ikebe; Daisuke Uchida; Yasuhiro Take; Makito Someya; Satoshi Chikuda; Kento Matsuyama; Tetsuya Asai; Tadahiro Kuroda; Masato Motomura

doi:10.3169/mta.4.142

3D stacked imager featuring inductive coupling channels for high speed/low-noise image transfer

Masayuki Ikebe, Daisuke Uchida, Yasuhiro Take, Makito Someya, Satoshi Chikuda, Kento Matsuyama, Tetsuya Asai, Tadahiro Kuroda, Masato Motomura

研究成果: Article › 査読

抄録

This paper proposes 3D stacked module consisting of image sensor and digital logic dies connected through inductive coupling channels. Evaluation of a prototype module revealed radiation noise from the inductive coils to the image sensor is less than 0.4-LSB range along with ADC code, i.e., negligible. Aiming at high frame rate image sensor/processing module exploiting this attractive off-die interface, we also worked on resolving another throughput-limiter, namely power consuming Time to Digital Converter (TDC) used in column parallel ADCs. Novel intermittent TDC operation scheme presented in this paper can reduce its power dissipation 57% from conventional ones.

本文言語	English
ページ（範囲）	142-148
ページ数	7
ジャーナル	ITE Transactions on Media Technology and Applications
巻	4
号	2
DOI	https://doi.org/10.3169/mta.4.142
出版ステータス	Published - 2016

ASJC Scopus subject areas

信号処理
メディア記述
コンピュータグラフィックスおよびコンピュータ支援設計

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10.3169/mta.4.142

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AU - Uchida, Daisuke

AU - Take, Yasuhiro

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AU - Chikuda, Satoshi

AU - Matsuyama, Kento

AU - Asai, Tetsuya

AU - Kuroda, Tadahiro

AU - Motomura, Masato

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3D stacked imager featuring inductive coupling channels for high speed/low-noise image transfer

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