TY - JOUR
T1 - 3D structural foramation utilizing glass transition of a Parylene film
AU - Kan, Tetsuo
AU - Isozaki, Akihiro
AU - Takahashi, Hidetoshi
AU - Matsumoto, Kiyoshi
AU - Shimoyama, Isao
PY - 2015/2/26
Y1 - 2015/2/26
N2 - This paper reports on a fabrication method of three-dimensional micro structures supported by a Parylene thin film. The three-dimensional structure formation procedure starts with an out-of-plane actuation of the Si surface micromachined structure coated with a thin Parylene film. At the same time of the actuation, the environmental temperature was elevated above the glass transition temperature Tg of the Parylene, 80-100 °C, and then cooled down below Tg. In this process, the rearrangement of the Parylene film happens above Tg, and the consolidated Parylene after the cooling down maintains three-dimensional micro structures as actuated. In a proof-of-principle experiment, the three-dimensional spiral structures formed by 300-nm-thick silicon were fixed by 1-μm-thick Parylene film.
AB - This paper reports on a fabrication method of three-dimensional micro structures supported by a Parylene thin film. The three-dimensional structure formation procedure starts with an out-of-plane actuation of the Si surface micromachined structure coated with a thin Parylene film. At the same time of the actuation, the environmental temperature was elevated above the glass transition temperature Tg of the Parylene, 80-100 °C, and then cooled down below Tg. In this process, the rearrangement of the Parylene film happens above Tg, and the consolidated Parylene after the cooling down maintains three-dimensional micro structures as actuated. In a proof-of-principle experiment, the three-dimensional spiral structures formed by 300-nm-thick silicon were fixed by 1-μm-thick Parylene film.
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U2 - 10.1109/MEMSYS.2015.7050975
DO - 10.1109/MEMSYS.2015.7050975
M3 - Conference article
AN - SCOPUS:84931046712
SN - 1084-6999
VL - 2015-February
SP - 405
EP - 408
JO - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
JF - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
IS - February
M1 - 7050975
T2 - 2015 28th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2015
Y2 - 18 January 2015 through 22 January 2015
ER -