TY - JOUR
T1 - 47% power reduction and 91% area reduction in inductive-coupling programmable bus for NAND flash memory stacking
AU - Saito, Mitsuko
AU - Yoshida, Yoichi
AU - Miura, Noriyuki
AU - Ishikuro, Hiroki
AU - Kuroda, Tadahiro
N1 - Funding Information:
Manuscript received March 30, 2010; revised June 18, 2010; accepted July 14, 2010. Date of publication September 23, 2010; date of current version October 01, 2010. This work is supported by CREST/JST. This paper was recommended by Associate Editor J. Rogers.
Funding Information:
This work is supported by CREST/JST.
PY - 2010
Y1 - 2010
N2 - This paper presents a power reduction scheme and an area reduction scheme in inductive-coupling programmable bus for NAND flash memory stacking. A channel arrangement scheme using three coils enables random access for memory read and memory write. Transmit power is reduced by 47% compared to a previous design with shields. A coil layout style, herein noted as XY coil, allows for the coils to interleave with logic interconnections, resulting in area reduction of 91% relative to at the expense of only 17% transmit power increase. Relayed data transmission at 1.6 Gb/s and BER < 10-12 is achieved.
AB - This paper presents a power reduction scheme and an area reduction scheme in inductive-coupling programmable bus for NAND flash memory stacking. A channel arrangement scheme using three coils enables random access for memory read and memory write. Transmit power is reduced by 47% compared to a previous design with shields. A coil layout style, herein noted as XY coil, allows for the coils to interleave with logic interconnections, resulting in area reduction of 91% relative to at the expense of only 17% transmit power increase. Relayed data transmission at 1.6 Gb/s and BER < 10-12 is achieved.
KW - Inductive coupling
KW - NAND flash
KW - memory stacking
KW - solid-state drive (SSD)
KW - three-dimensional
KW - wireless interconnect
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U2 - 10.1109/TCSI.2010.2071670
DO - 10.1109/TCSI.2010.2071670
M3 - Article
AN - SCOPUS:77957749589
SN - 1549-8328
VL - 57
SP - 2269
EP - 2278
JO - IEEE Transactions on Circuits and Systems I: Regular Papers
JF - IEEE Transactions on Circuits and Systems I: Regular Papers
IS - 9
M1 - 5582165
ER -