TY - GEN
T1 - A 12.5Gb/s/link non-contact multi drop bus system with impedance-matched transmission line couplers and dicode partial-response channel transceivers
AU - Kosuge, Atsutake
AU - Mizuhara, Wataru
AU - Miura, Noriyuki
AU - Taguchi, Masao
AU - Ishikuro, Hiroki
AU - Kuroda, Tadahiro
PY - 2012/11/26
Y1 - 2012/11/26
N2 - A reduced-reflection multi-drop bus system using Dicode (1-D) partial response signaling transceiver is presented for the first time in the world. Directional couplers on transmission lines arranged with equi-energy distributing and exact impedance matched conditions allow the bus to reach to 12.5Gbps/link speed. The transmission line has 5-convex portions to form one side of a coupler where the transmission line width is adjusted to control the characteristic impedance of the coupling section, minimizing signal reflection from each section. Dicode partial-response signaling method with a half-rate architecture was used where a precoder is placed in the transmitter to make the signal best fit for the channel to eliminate inter symbol interference (ISI) where the test chip transmitter occupies 3,750 μm2 and the receiver occupies 750 μm2 with 90nm CMOS technology, consuming 40mA and 23mA respectively at the supply voltage of 1.2V.
AB - A reduced-reflection multi-drop bus system using Dicode (1-D) partial response signaling transceiver is presented for the first time in the world. Directional couplers on transmission lines arranged with equi-energy distributing and exact impedance matched conditions allow the bus to reach to 12.5Gbps/link speed. The transmission line has 5-convex portions to form one side of a coupler where the transmission line width is adjusted to control the characteristic impedance of the coupling section, minimizing signal reflection from each section. Dicode partial-response signaling method with a half-rate architecture was used where a precoder is placed in the transmitter to make the signal best fit for the channel to eliminate inter symbol interference (ISI) where the test chip transmitter occupies 3,750 μm2 and the receiver occupies 750 μm2 with 90nm CMOS technology, consuming 40mA and 23mA respectively at the supply voltage of 1.2V.
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U2 - 10.1109/CICC.2012.6330611
DO - 10.1109/CICC.2012.6330611
M3 - Conference contribution
AN - SCOPUS:84869427901
SN - 9781467315555
T3 - Proceedings of the Custom Integrated Circuits Conference
BT - Proceedings of the IEEE 2012 Custom Integrated Circuits Conference, CICC 2012
T2 - 34th Annual Custom Integrated Circuits Conference, CICC 2012
Y2 - 9 September 2012 through 12 September 2012
ER -