抄録
A frequency drift of open-loop PLL is an issue for the direct-modulation applications such as Bluetooth transceiver. The drift mainly comes from a temperature variation of VCO during the transmission operation. In this paper, we propose the optimum location of the VCO, considering the temperature gradient through the whole-chip thermal analysis. Moreover, a novel temperature- compensated VCO, employing a new biasing scheme, is proposed. The combination of these two techniques enables the power reduction of the transmitter by 33% without sacrificing the performance.
本文言語 | English |
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ページ(範囲) | 490-495 |
ページ数 | 6 |
ジャーナル | IEICE Transactions on Electronics |
巻 | E88-C |
号 | 4 |
DOI | |
出版ステータス | Published - 2005 4月 |
外部発表 | はい |
ASJC Scopus subject areas
- 電子材料、光学材料、および磁性材料
- 電子工学および電気工学