A mechanical reliability assessment of solder joints

K. Kishimoto, Masaki Omiya, M. Amagai

研究成果: Conference contribution

5 被引用数 (Scopus)


A mechanical reliability of the solder joints is a serious concern. Intermetallic compounds are formed during reflow process between solder and electrical pads and gradually grow in service. Due to it's brittle manner, the reliability of solder joints are supposed to degenerate. By using the Cu-plates on which Cu or Ni or Ni+Au plating was deposited, and solders (Sn-Pb solders or Sn-Ag-Cu solders), specimens of solder joints were fabricated. After aging it in an isothermal chamber, tensile tests were performed and the relationships between solder joint strength and aging period were considered. From SEM microscope observation and EDX microprobe analysis, the growth and components of the intermetallic compounds layer were examined. To investigate the stress condition on the solder joint interface, the finite element analysis was also carried out.

ホスト出版物のタイトルAdvances in Electronic Materials and Packaging 2001
出版社Institute of Electrical and Electronics Engineers Inc.
ISBN(印刷版)0780371577, 9780780371576
出版ステータスPublished - 2001
イベント3rd International Symposium on Electronic Materials and Packaging, EMAP 2001 - Jeju Island, Korea, Republic of
継続期間: 2001 11月 192001 11月 22


Other3rd International Symposium on Electronic Materials and Packaging, EMAP 2001
国/地域Korea, Republic of
CityJeju Island

ASJC Scopus subject areas

  • 電子工学および電気工学
  • 電子材料、光学材料、および磁性材料


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