抄録
A mechanical reliability of the solder joints is a serious concern. Intermetallic compounds are formed during reflow process between solder and electrical pads and gradually grow in service. Due to it's brittle manner, the reliability of solder joints are supposed to degenerate. By using the Cu-plates on which Cu or Ni or Ni+Au plating was deposited, and solders (Sn-Pb solders or Sn-Ag-Cu solders), specimens of solder joints were fabricated. After aging it in an isothermal chamber, tensile tests were performed and the relationships between solder joint strength and aging period were considered. From SEM microscope observation and EDX microprobe analysis, the growth and components of the intermetallic compounds layer were examined. To investigate the stress condition on the solder joint interface, the finite element analysis was also carried out.
| 本文言語 | English |
|---|---|
| ホスト出版物のタイトル | Advances in Electronic Materials and Packaging 2001 |
| 出版社 | Institute of Electrical and Electronics Engineers Inc. |
| ページ | 8-14 |
| ページ数 | 7 |
| ISBN（印刷版） | 0780371577, 9780780371576 |
| DOI | |
| 出版ステータス | Published - 2001 |
| 外部発表 | はい |
| イベント | 3rd International Symposium on Electronic Materials and Packaging, EMAP 2001 - Jeju Island, Korea, Republic of 継続期間: 2001 11月 19 → 2001 11月 22 |
Other
| Other | 3rd International Symposium on Electronic Materials and Packaging, EMAP 2001 |
|---|---|
| 国/地域 | Korea, Republic of |
| City | Jeju Island |
| Period | 01/11/19 → 01/11/22 |
ASJC Scopus subject areas
- 電子工学および電気工学
- 電子材料、光学材料、および磁性材料