TY - GEN
T1 - A parametric design framework to support structural and functional modeling of complex consumer electronics products
AU - Seki, Kenichi
AU - Nishimura, Hidekazu
AU - Zhu, Shaopeng
AU - Balmelli, Laurent
N1 - Copyright:
Copyright 2012 Elsevier B.V., All rights reserved.
PY - 2011
Y1 - 2011
N2 - Today's market demand for smaller and more powerful consumer electronic devices poses a major challenge to the rapid design of products. In addition, the ability to perform strategic coordination among different stakeholders within the enterprise increasingly becomes an important criterion for global engineering. In this study, we first introduce a typical design process involving distributed design teams. In particular, this process allows a thermal-acoustic design of cavities, i.e., air space inside the enclosure, in terms of flow rate and acoustic radiation resistance. Then, we investigate a module-based design optimization approach defining cavity as a module to efficiently support such processes. We ensure the design control of both cavity characteristics in an internationally distributed project through design data analysis using the Systems Modeling Language (SysML) and the resulting product model descriptions of the system architecture.
AB - Today's market demand for smaller and more powerful consumer electronic devices poses a major challenge to the rapid design of products. In addition, the ability to perform strategic coordination among different stakeholders within the enterprise increasingly becomes an important criterion for global engineering. In this study, we first introduce a typical design process involving distributed design teams. In particular, this process allows a thermal-acoustic design of cavities, i.e., air space inside the enclosure, in terms of flow rate and acoustic radiation resistance. Then, we investigate a module-based design optimization approach defining cavity as a module to efficiently support such processes. We ensure the design control of both cavity characteristics in an internationally distributed project through design data analysis using the Systems Modeling Language (SysML) and the resulting product model descriptions of the system architecture.
KW - Consumer Electronics
KW - Global Engineering
KW - Product Model
KW - Simulation
KW - SysML
UR - http://www.scopus.com/inward/record.url?scp=84858847972&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84858847972&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:84858847972
SN - 9781904670261
T3 - ICED 11 - 18th International Conference on Engineering Design - Impacting Society Through Engineering Design
SP - 282
EP - 291
BT - ICED 11 - 18th International Conference on Engineering Design - Impacting Society Through Engineering Design
T2 - 18th International Conference on Engineering Design, ICED 11
Y2 - 15 August 2011 through 18 August 2011
ER -