Multi-stack wafer bonding is one of the most promising fabrication techniques for creating three-dimensional microstructures, such as for power MEMS devices. However, there are several bonding issues that MEMS technologists have to face and overcome to successfully build multilayered structures. Among these are: (1) Chemical residues on surfaces to be bonded originating from the fabrication processes prior to bonding, (2) Increased stiffness due to multiple bonded wafers and/or thick wafers, (3) Bonding tool effects, and (4) Defect propagation to other wafer levels after high-temperature annealing cycles. The problems and the solutions presented here are readily applicable to any MEMS project involving the fabrication of multi-stack structures of two or more wafers containing intricate geometries and large etched areas.
|Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS)
|Published - 2002 1月 1
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