TY - JOUR
T1 - Adhesion energy of Cu/polyimide interface in flexible printed circuits
AU - Kamiya, Shoji
AU - Furuta, Harunori
AU - Omiya, Masaki
PY - 2007/12/15
Y1 - 2007/12/15
N2 - The adhesion strength of interfaces was evaluated for two Cu/polyimide laminates, which had the same interface but different polyimide film thickness. A new technique was applied to evaluate the bond energy of the interface, where micro scale polyimide film blocks were scratched off from the interface-side surface of the copper film. Energy consumed during plastic deformation was successfully calculated with the help of a numerical simulation for crack extension. Contrary to the results of conventional peel tests which yielded 340 J/m 2 and 580 J/m 2, respectively for the two samples, the interfacial adhesion energy was obtained as 30 J/m 2 and 25 J/m 2 by the new technique.
AB - The adhesion strength of interfaces was evaluated for two Cu/polyimide laminates, which had the same interface but different polyimide film thickness. A new technique was applied to evaluate the bond energy of the interface, where micro scale polyimide film blocks were scratched off from the interface-side surface of the copper film. Energy consumed during plastic deformation was successfully calculated with the help of a numerical simulation for crack extension. Contrary to the results of conventional peel tests which yielded 340 J/m 2 and 580 J/m 2, respectively for the two samples, the interfacial adhesion energy was obtained as 30 J/m 2 and 25 J/m 2 by the new technique.
KW - Adhesion
KW - Cu/polyimide interface
KW - Energy
KW - Flexible printed circuit
KW - Plastic deformation
KW - Strength
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U2 - 10.1016/j.surfcoat.2007.07.061
DO - 10.1016/j.surfcoat.2007.07.061
M3 - Article
AN - SCOPUS:36048968863
SN - 0257-8972
VL - 202
SP - 1084
EP - 1088
JO - Surface and Coatings Technology
JF - Surface and Coatings Technology
IS - 4-7
ER -