TY - GEN
T1 - Angular Accelerometer with Integrated Liquid Spiral Channel and lig Sensing Element on Polyimide Film
AU - Nakashima, Rihachiro
AU - Takahashi, Hidetoshi
N1 - Funding Information:
This work was partially supported by the JSPS KAKENHI under Grant 20H02102 and the “Innovation inspired by Nature” Research Support Program, SEKISUI CHEMICAL CO., LTD.
Publisher Copyright:
© 2022 IEEE.
PY - 2022
Y1 - 2022
N2 - This paper reports on the fabrication method of an angular accelerometer with integrated liquid spiral channels and laser-induced graphene (LIG) sensing element. The proposed fabrication process forms the LIG sensing element and the spiral grooves via a CO2 laser and a UV laser, respectively, on a polyimide (PI) film. The liquid-sealed spiral channels are fabricated by filling the grooves with silicone oil and applying parylene deposition. Thus, the fabrication process is quite ple. The prototype sensor was validated for its response to angular acceleration.
AB - This paper reports on the fabrication method of an angular accelerometer with integrated liquid spiral channels and laser-induced graphene (LIG) sensing element. The proposed fabrication process forms the LIG sensing element and the spiral grooves via a CO2 laser and a UV laser, respectively, on a polyimide (PI) film. The liquid-sealed spiral channels are fabricated by filling the grooves with silicone oil and applying parylene deposition. Thus, the fabrication process is quite ple. The prototype sensor was validated for its response to angular acceleration.
KW - Angular accelerometer
KW - LIG strain gauge
KW - Liquid spiral channel
KW - Parylene deposition
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U2 - 10.1109/MEMS51670.2022.9699455
DO - 10.1109/MEMS51670.2022.9699455
M3 - Conference contribution
AN - SCOPUS:85126396248
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 747
EP - 749
BT - 35th IEEE International Conference on Micro Electro Mechanical Systems Conference, MEMS 2022
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 35th IEEE International Conference on Micro Electro Mechanical Systems Conference, MEMS 2022
Y2 - 9 January 2022 through 13 January 2022
ER -