Centrifugal and hydroplaning phenomena in high-speed polishing

Super fine polishing with compliant tools can achieve nanoscale roughness, but has limited productivity due to low material removal rate (MRR). Increased spindle speed in high-speed polishing (HSP) might increase MRR, but significant challenges appear above 10,000 rpm because of centrifugal deformation of the tool and pad lifting due to hydroplaning phenomenon. Here, a tool offset compensation strategy is proposed for centrifugal deformation and novel pad patterning design that mitigates hydroplaning. Through this new approach, linear increase in MRR for spindle speed up to 24,000 rpm is demonstrated. This work lays the foundation for future developments of HSP in fabrication of ultraprecision optics.